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TDA7580

STMicroelectronics

TDA7580 by STMicroelectronics

TDA7580 by STMicroelectronics is a low-profile consumer IC designed for automotive applications, operating b/w -40 °C and 125 °C. It features a compact 64-terminal package with a supply voltage range of 1.7V to 1.9V. Ideal for surface mount designs, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,947 parts In-Stock

1+ parts

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2,947

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Anansix

USA . 2,831 parts In-Stock

1+ parts

-

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2,831

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Digiode

USA . 1,576 parts In-Stock

1+ parts

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1,576

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,916 parts In-Stock

1+ parts

$0.818

100+ parts

-

1k+ parts

$0.736

10k+ parts

-

1,916

$0.818

-

$0.736

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MKK Technologies

India . 1,355 parts In-Stock

1+ parts

$1.538

100+ parts

-

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1,355

$1.538

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DigiPath Technology Company

USA . 1,355 parts In-Stock

1+ parts

$1.538

100+ parts

-

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-

10k+ parts

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1,355

$1.538

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AZTECH Wire

Italy . 571 parts In-Stock

1+ parts

$18.910

100+ parts

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571

$18.910

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A-Z Elektronik GmbH

Germany . 5,540 parts In-Stock

1+ parts

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5,540

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Corphita

USA . 4,736 parts In-Stock

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4,736

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Parana Technologies

USA . 917 parts In-Stock

1+ parts

-

100+ parts

$0.978

1k+ parts

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917

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$0.978

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Overview

Elevate your audio experience with the TDA7580 from STMicroelectronics, a leader in innovative consumer ICs. This high-performance solution delivers exceptional sound quality and reliability for automotive applications, ensuring you're always tuned in to perfection. Its compact design and robust temperature range make it ideal for various environments, while ST's commitment to excellence means you can trust its durability and efficiency. Discover the next level of audio clarity and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials enhances the reliability and longevity of the IC, making it well-suited for various consumer applications.

Surface Mount: YES

Being surface mount compatible facilitates easy integration into modern circuit boards, enabling space-saving designs and efficient manufacturing.

Package Shape: SQUARE

The square package shape optimizes layout efficiency and allows for better heat dissipation, beneficial for high-density applications.

General IC Type: CONSUMER CIRCUIT

Designed specifically as a consumer circuit, this IC is tailored to meet the needs of a wide range of consumer electronic devices.

Power Supplies (V): 1.8, 3.3

Supports multiple power supply voltages, providing flexibility in design and compatibility with various systems.

No. of Terminals: 64

The 64 terminals allow for a rich set of functionalities, enabling complex integration and ensuring robustness in performance.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile, fine-pitch flatpack style enables compact designs while supporting high-performance requirements in consumer electronics.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in extreme conditions, making it suitable for automotive and demanding consumer applications.

Minimum Operating Temperature: -40 °C

Withstand low temperatures, ensuring performance in diverse environments, which is critical for automotive electronics.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent conductivity and resistance to corrosion, enhancing overall durability.

Terminal Position: QUAD

The quad terminal position allows efficient space utilization and layout flexibility in IC design.

Maximum Seated Height: 1.6 mm

A low seated height is advantageous for space-constrained designs, enhancing the product's integration into compact electronic systems.

Width: 10 mm

A standardized width that simplifies the design process and ensures compatibility with existing layouts.

Minimum Supply Voltage (Vsup): 1.7 V

Accommodates low supply voltages, which is beneficial for power-sensitive applications and energy-efficient designs.

Length: 10 mm

A consistent length that adheres to industry standards, allowing for seamless integration into various circuit designs.

Temperature Grade: AUTOMOTIVE

The automotive grade certification indicates high reliability and performance, essential for automotive applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and mechanical strength, ensuring robust connections in demanding environments.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for high-density packing of components, suitable for advanced consumer electronic designs.

Maximum Supply Voltage (Vsup): 1.9 V

Supports a specific range of supply voltages, making it versatile for different circuit requirements while ensuring stable operations.

Technical Specifications

Other Function Consumer ICs TDA7580 attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO OPERATES FROM 3.15V TO 3.45V

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TDA7580 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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