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TDA7502

STMicroelectronics

TDA7502 by STMicroelectronics

TDA7502 by STMicroelectronics is a 44-terminal consumer IC with operating temperature range of -40 to 125 °C. It features low profile flatpack package, suitable for automotive applications. With supply voltage range of 3.15-3.45V, it is ideal for various consumer circuit designs requiring compact form factor and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,938 parts In-Stock

1+ parts

-

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4,938

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Digiode

USA . 822 parts In-Stock

1+ parts

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-

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822

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Anansix

USA . 345 parts In-Stock

1+ parts

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345

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 833 parts In-Stock

1+ parts

$0.972

100+ parts

-

1k+ parts

$0.875

10k+ parts

-

833

$0.972

-

$0.875

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MKK Technologies

India . 1,826 parts In-Stock

1+ parts

$1.829

100+ parts

-

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1,826

$1.829

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DigiPath Technology Company

USA . 1,826 parts In-Stock

1+ parts

$1.829

100+ parts

-

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-

10k+ parts

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1,826

$1.829

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AZTECH Wire

Italy . 556 parts In-Stock

1+ parts

$16.780

100+ parts

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556

$16.780

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A-Z Elektronik GmbH

Germany . 6,333 parts In-Stock

1+ parts

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6,333

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Microchip USA

USA . 4,339 parts In-Stock

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4,339

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Parana Technologies

USA . 1,316 parts In-Stock

1+ parts

-

100+ parts

$1.163

1k+ parts

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1,316

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$1.163

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Corphita

USA . 118 parts In-Stock

1+ parts

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118

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Kepictronics

USA . 89 parts In-Stock

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89

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Overview

Unlock the potential of your consumer electronics with the TDA7502 by STMicroelectronics. Manufactured with precision and expertise, this versatile IC offers a wide array of applications in the consumer circuit category. With its compact design and high-quality materials, this product ensures reliable performance in automotive environments. Experience seamless integration, improved functionality, and enhanced efficiency with the TDA7502, setting a new standard for consumer ICs. Elevate your products to new heights with STMicroelectronics' innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Package Shape: SQUARE

The square shape helps in optimizing space on the circuit board and allows for efficient placement of components.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronics, ensuring compatibility and reliability in consumer products.

No. of Terminals: 44

With a high number of terminals, this IC can support complex circuitry and connections.

Maximum Operating Temperature: 125 °C

The high operating temperature range allows the IC to perform reliably under various environmental conditions.

Minimum Operating Temperature: -40 °C

The low operating temperature ensures the IC can withstand cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

The quad terminal position allows for efficient soldering and connection of the IC to the circuit board.

Maximum Seated Height: 1.6 mm

The low profile design of the IC allows for compact and slim electronic devices.

Width: 10 mm

The compact width of the IC enables space-saving design solutions in electronic products.

Minimum Supply Voltage (Vsup): 3.15 V

Low minimum supply voltage requirement ensures energy efficiency and compatibility with a wide range of power sources.

Length: 10 mm

The small length of the IC allows for flexibility in placement and design of electronic products.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliability and performance in harsh operating conditions.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and connection to the circuit board, enhancing ease of assembly.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting, enabling compact and efficient circuit designs.

Maximum Supply Voltage (Vsup): 3.45 V

The maximum supply voltage rating ensures safety and compatibility with various power sources.

Technical Specifications

Other Function Consumer ICs TDA7502 attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e4

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TDA7502 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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