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TDA7479ADTR

STMicroelectronics

TDA7479ADTR by STMicroelectronics

TDA7479ADTR by STMicroelectronics is a CMOS consumer IC designed for industrial applications. It operates b/w -40 °C to 85°C, with a supply voltage range of 4.5V to 5.5V and consumes a max current of 11mA. Its compact SOIC package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,337 parts In-Stock

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6,337

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Anansix

USA . 2,544 parts In-Stock

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2,544

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Digiode

USA . 1,203 parts In-Stock

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1,203

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,709 parts In-Stock

1+ parts

$1.823

100+ parts

-

1k+ parts

$1.640

10k+ parts

-

1,709

$1.823

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$1.640

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MKK Technologies

India . 254 parts In-Stock

1+ parts

$3.427

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-

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254

$3.427

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DigiPath Technology Company

USA . 254 parts In-Stock

1+ parts

$3.427

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254

$3.427

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AZTECH Wire

Italy . 161 parts In-Stock

1+ parts

$9.920

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161

$9.920

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A-Z Elektronik GmbH

Germany . 6,012 parts In-Stock

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6,012

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Corphita

USA . 4,283 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 998 parts In-Stock

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$2.179

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998

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$2.179

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Overview

Elevate your audio experience with the TDA7479ADTR from STMicroelectronics, a leader in innovative consumer IC solutions. This exceptional chip delivers unparalleled sound quality and reliability, making it perfect for diverse applications—from home entertainment systems to portable devices. With its compact design and robust temperature range, you can trust the TDA7479ADTR to enhance your projects while enjoying the backing of a globally recognized manufacturer dedicated to excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability, making it suitable for various consumer applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, making it ideal for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape maximizes space utilization on the PCB, fitting well with other components in a design.

General IC Type: CONSUMER CIRCUIT

Designed specifically as a consumer circuit IC, this product caters to the needs of everyday electronic devices, ensuring functionality and performance.

Power Supplies (V): 5

Operating at a nominal voltage of 5V makes this IC compatible with a wide range of consumer electronics, simplifying design integration.

No. of Terminals: 16

With 16 terminals, this IC provides ample connectivity options for various functions, enhancing its versatility in applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make this IC an excellent choice for space-constrained designs, providing ease of routing on PCBs.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures that this IC can function reliably in moderately harsh environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is suitable for a variety of applications in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent corrosion resistance and ensures good solderability, contributing to reliability.

Terminal Position: DUAL

Dual terminal positioning allows for flexible routing on the PCB, which can ease layout and assembly processes.

Maximum Seated Height: 1.2 mm

A low seated height of 1.2 mm facilitates a slim profile design, which is highly desirable in modern electronics.

Width: 4.4 mm

With a width of 4.4 mm, this IC can fit into tighter spaces on PCBs, accommodating compact device designs.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage requirement of 4.5V provides flexibility in voltage sourcing for device integration.

Maximum Time At Peak Reflow Temperature (s): 40

This IC can withstand reflow soldering processes with a maximum peak time of 40 seconds, which is advantageous for assembly.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C is within industry standards, ensuring compatibility with modern soldering techniques.

Length: 5 mm

At only 5 mm in length, this IC is suitable for compact applications, allowing for high-density component placement.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance across a broad range of environmental conditions.

Technology: CMOS

Using CMOS technology provides low power consumption while maintaining high performance, which is essential for consumer ICs.

Terminal Form: GULL WING

Gull wing terminals facilitate better solder joint inspection and make it easier to handle during assembly.

Maximum Supply Current: 11 mA

With a maximum supply current of 11 mA, this IC is energy-efficient, making it suitable for battery-powered devices.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm strikes a balance between compact design and ease of handling, contributing to the overall versatility.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, making proper handling and packaging practices important but feasible.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V offers flexibility in power supply choices, broadening the range of applications for which this IC can be used.

Technical Specifications

Other Function Consumer ICs TDA7479ADTR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

11 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

TDA7479ADTR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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