Loading...

TDA7460NDTR

STMicroelectronics

TDA7460NDTR by STMicroelectronics

TDA7460NDTR by STMicroelectronics is a versatile consumer IC designed for industrial applications, operating b/w 7.5V and 10V. It features a compact 20-terminal SO package with a max temp of 85 °C and utilizes BICMOS technology. Ideal for surface mount designs, it ensures reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,336 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,336

-

-

-

-

Digiode

USA . 4,649 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,649

-

-

-

-

Anansix

USA . 2,096 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,096

-

-

-

-

Cyclops Electronics Ltd

UK . 400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

400

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,158 parts In-Stock

1+ parts

$2.303

100+ parts

-

1k+ parts

$2.072

10k+ parts

-

2,158

$2.303

-

$2.072

-

MKK Technologies

India . 1,186 parts In-Stock

1+ parts

$4.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,186

$4.330

-

-

-

DigiPath Technology Company

USA . 1,186 parts In-Stock

1+ parts

$4.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,186

$4.330

-

-

-

Microchip USA

USA . 318 parts In-Stock

1+ parts

$6.280

100+ parts

-

1k+ parts

-

10k+ parts

-

318

$6.280

-

-

-

AZTECH Wire

Italy . 1,077 parts In-Stock

1+ parts

$20.620

100+ parts

-

1k+ parts

-

10k+ parts

-

1,077

$20.620

-

-

-

RC Electronics

USA . 12,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,750

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,261 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,261

-

-

-

-

Corphita

USA . 4,531 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,531

-

-

-

-

Parana Technologies

USA . 580 parts In-Stock

1+ parts

-

100+ parts

$2.753

1k+ parts

-

10k+ parts

-

580

-

$2.753

-

-

Kepictronics

USA . 356 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

356

-

-

-

-

Overview

Elevate your audio experience with the TDA7460NDTR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This versatile consumer IC promises exceptional sound quality, offering reliable performance across various applications—from home audio systems to automotive infotainment. With its robust design and superior durability, you can count on the TDA7460NDTR for seamless integration and longevity, ensuring that your devices deliver that rich, crystal-clear audio you crave.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures reliability and performance in various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and easy integration onto circuit boards.

Package Shape: RECTANGULAR

Rectangular shape facilitates efficient space utilization on PCBs.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, providing tailored performance and features.

Power Supplies (V): 9

Standard power supply voltage that aligns well with common consumer electronics.

No. of Terminals: 20

20 terminals provide sufficient connectivity options for complex functionalities.

Package Style (Meter): SMALL OUTLINE

Small outline package supports space-saving designs, ideal for compact devices.

Maximum Operating Temperature: 85 °C

Can operate in higher temperature environments, enhancing reliability in various conditions.

Minimum Operating Temperature: -40 °C

Suitable for extreme temperature ranges, making it robust for outdoor and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures excellent conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal positioning allows for flexible design options and better PCB layout.

Maximum Seated Height: 2.65 mm

Low-profile design enables efficient stacking and reduces overall form factor.

Width: 7.5 mm

Compact width assists in minimizing the size of electronic assemblies.

Minimum Supply Voltage (Vsup): 7.5 V

Ensures compatibility with a wide range of power supply solutions.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering processes without damaging the IC.

Peak Reflow Temperature °C: 260

High peak temperature tolerance ensures robustness during manufacturing.

Length: 12.8 mm

Length offers a balance between functionality and compact design.

Temperature Grade: INDUSTRIAL

Industrial grading increases the reliability and suitability for long-term applications.

Technology: BICMOS

Combines the advantages of bipolar and CMOS technologies for enhanced performance.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and visual inspection.

Terminal Pitch: 1.27 mm

Standard pitch allows for compatibility with various PCB layouts.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity suitable for a range of manufacturing environments.

Maximum Supply Voltage (Vsup): 10 V

Wide supply voltage range allows for flexibility in design and application.

Technical Specifications

Other Function Consumer ICs TDA7460NDTR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

TDA7460NDTR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20