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TDA7433D013TR

STMicroelectronics

TDA7433D013TR by STMicroelectronics

TDA7433D013TR by STMicroelectronics is a consumer IC designed for industrial applications, featuring a compact 20-terminal SO package. It operates b/w -40 °C to 85°C with a supply voltage range of 7V to 10.2V and consumes a max current of 11mA. Ideal for audio processing in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,778 parts In-Stock

1+ parts

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5,778

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PC Components Company LLC

USA . 3,390 parts In-Stock

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3,390

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Bristol Electronics

USA . 3,390 parts In-Stock

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3,390

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Digiode

USA . 2,741 parts In-Stock

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2,741

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Anansix

USA . 2,389 parts In-Stock

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2,389

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,918 parts In-Stock

1+ parts

$1.971

100+ parts

-

1k+ parts

$1.774

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-

1,918

$1.971

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$1.774

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MKK Technologies

India . 2,257 parts In-Stock

1+ parts

$3.706

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2,257

$3.706

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DigiPath Technology Company

USA . 2,257 parts In-Stock

1+ parts

$3.706

100+ parts

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2,257

$3.706

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AZTECH Wire

Italy . 1,113 parts In-Stock

1+ parts

$20.340

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1,113

$20.340

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QUARKTWIN TECHNOLOGY LTD

USA . 22,975 parts In-Stock

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22,975

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Metaverse IC Inc.

Canada . 8,000 parts In-Stock

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8,000

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Microchip USA

USA . 6,189 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Corphita

USA . 1,356 parts In-Stock

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1,356

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RC Electronics

USA . 1,193 parts In-Stock

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1,193

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Parana Technologies

USA . 18 parts In-Stock

1+ parts

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$2.356

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18

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$2.356

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Overview

Elevate your audio experience with the TDA7433D013TR from STMicroelectronics, a trusted leader in cutting-edge technology. This versatile consumer IC delivers outstanding sound quality while ensuring reliability across various applications like home entertainment and automotive systems. With robust performance in extreme temperatures, its compact design effortlessly integrates into your projects, offering exceptional value and peace of mind for any electronics enthusiast.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easier integration into compact circuits, reducing assembly time and enabling more efficient use of board space.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on PCBs and allows for better arrangement of terminals.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, this IC is tailored for performance in everyday electronics, ensuring reliability and effectiveness.

No. of Terminals: 20

With 20 terminals, this IC offers ample connectivity options for integration into complex circuits, enhancing its versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package supports space-constrained designs without compromising on performance.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C allows the IC to function reliably in various environments, making it well-suited for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C ensures dependable performance in harsh conditions, expanding its application range.

Terminal Finish: TIN

The tin terminal finish provides good solderability and oxidation resistance, enhancing the longevity and reliability of connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible circuit design and layout, improving integration options in various electronic systems.

Maximum Seated Height: 2.65 mm

A low seated height facilitates compact designs, making it ideal for thin electronic devices.

Width: 7.5 mm

A width of 7.5 mm strikes a balance between compactness and usability, allowing for efficient space utilization on PCB.

Minimum Supply Voltage (Vsup): 7 V

The requirement for a minimum supply voltage of 7V makes this IC suitable for a variety of mid-range power applications.

Length: 12.8 mm

The length of 12.8 mm contributes to the overall compactness of the product, making it suitable for smaller devices.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures that the IC can operate in demanding environments, enhancing its reliability for industrial uses.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and solder joint reliability, ideal for automated assembly processes.

Maximum Supply Current: 11 mA

With a maximum supply current of 11mA, this IC is energy efficient, making it an excellent choice for low-power applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for easier layout and improves soldering accuracy in automated assembly systems.

Maximum Supply Voltage (Vsup): 10.2 V

Supporting a maximum supply voltage of 10.2V enables the IC to be employed in a varied range of application scenarios, accommodating different design needs.

Technical Specifications

Other Function Consumer ICs TDA7433D013TR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

11 mA

Maximum Supply Voltage (Vsup):

10.2 V

Minimum Supply Voltage (Vsup):

7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA7433D013TR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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