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TDA7402TR

STMicroelectronics

TDA7402TR by STMicroelectronics

TDA7402TR by STMicroelectronics is a consumer IC designed for industrial applications, operating b/w 7.5V and 10V. It features a low-profile flatpack package with 44 terminals and operates in temperatures from -40 °C to 85°C. Ideal for compact electronic devices, it ensures reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,936 parts In-Stock

1+ parts

-

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8,936

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Anansix

USA . 1,049 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,049

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Digiode

USA . 582 parts In-Stock

1+ parts

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-

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582

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,210 parts In-Stock

1+ parts

$3.072

100+ parts

-

1k+ parts

$2.765

10k+ parts

-

1,210

$3.072

-

$2.765

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Microchip USA

USA . 458 parts In-Stock

1+ parts

$4.250

100+ parts

-

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458

$4.250

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MKK Technologies

India . 654 parts In-Stock

1+ parts

$5.776

100+ parts

-

1k+ parts

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654

$5.776

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-

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DigiPath Technology Company

USA . 654 parts In-Stock

1+ parts

$5.776

100+ parts

-

1k+ parts

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10k+ parts

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654

$5.776

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AZTECH Wire

Italy . 81 parts In-Stock

1+ parts

$16.940

100+ parts

-

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81

$16.940

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Corphita

USA . 4,590 parts In-Stock

1+ parts

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4,590

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Parana Technologies

USA . 468 parts In-Stock

1+ parts

-

100+ parts

$3.673

1k+ parts

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468

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$3.673

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Overview

Unlock superior audio experiences with the TDA7402TR from STMicroelectronics, a leader in innovative consumer ICs. This compact, high-performance chip seamlessly integrates into your applications, delivering exceptional sound quality and reliability. Designed for diverse environments, it thrives under varying temperatures, ensuring consistent performance. Elevate your products with this trusted solution that promises unmatched value, efficiency, and longevity—perfect for today's demanding audio needs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability, lightweight construction, and resistance to environmental factors, making the product reliable in various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint, facilitating easier integration into compact devices and improving manufacturing efficiency.

Package Shape: SQUARE

The square shape of the package optimizes space on the PCB and improves thermal management.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, this IC meets the demands of high-performance audio and video devices.

Power Supplies: 9 V

Operating at 9V makes it versatile for use in numerous household and portable devices.

No. of Terminals: 44

A higher number of terminals allows for more extensive functionality and connectivity options in the circuit design.

Package Style: FLATPACK, HEAT SINK/SLUG, LOW PROFILE

The low profile design with heat sink capabilities aids in efficient heat dissipation, enhancing the product's performance in demanding applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC is suitable for use in environments prone to higher heat, ensuring reliability.

Minimum Operating Temperature: -40 °C

The wide temperature range means the product can reliably function in extreme conditions, perfect for industrial and outdoor applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish improves solderability and provides a reliable electrical connection over time.

Terminal Position: QUAD

The quad terminal positioning enhances ease of PCB design and assembly, resulting in efficient use of space.

Maximum Seated Height: 1.6 mm

A low seated height reduces the overall profile of the device, contributing to space-saving in circuit designs.

Width: 10 mm

A compact width allows for versatile placement options on the PCB.

Minimum Supply Voltage: 7.5 V

This low minimum supply voltage requirement makes the IC adaptable to a variety of power systems.

Maximum Time At Peak Reflow Temperature: 30 s

This allows for greater flexibility in manufacturing processes while ensuring component integrity during soldering.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature makes it suitable for modern high-temperature soldering processes, ensuring compatibility with advanced PCB assembly.

Length: 10 mm

A compact length complements the width, contributing to an overall small footprint on the PCB.

Temperature Grade: INDUSTRIAL

Industrial-grade components ensure durability and reliability under harsh conditions, ideal for critical applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve mechanical stability on the PCB.

Terminal Pitch: 0.8 mm

A fine terminal pitch allows for high-density designs, enabling more features in smaller packages.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates that the product can withstand a limited exposure to moisture, useful for various environments.

Maximum Supply Voltage: 10 V

Support for a maximum of 10V provides flexibility in power supply choices for various consumer electronics.

Technical Specifications

Other Function Consumer ICs TDA7402TR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TDA7402TR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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