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TDA7333NTR

STMicroelectronics

TDA7333NTR by STMicroelectronics

TDA7333NTR by STMicroelectronics is a CMOS consumer IC designed for industrial applications, operating b/w 3V and 3.6V. It features a compact 16-terminal package with a max temp of 85 °C and a thin profile of just 1.2mm height. Ideal for surface mount designs, it ensures reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,560 parts In-Stock

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4,560

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Vyrian

USA . 3,605 parts In-Stock

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3,605

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Anansix

USA . 1,012 parts In-Stock

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1,012

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 894 parts In-Stock

1+ parts

$3.235

100+ parts

-

1k+ parts

$2.911

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894

$3.235

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$2.911

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MKK Technologies

India . 842 parts In-Stock

1+ parts

$6.083

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-

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842

$6.083

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DigiPath Technology Company

USA . 842 parts In-Stock

1+ parts

$6.083

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842

$6.083

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Microchip USA

USA . 257 parts In-Stock

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$6.703

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257

$6.703

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AZTECH Wire

Italy . 40 parts In-Stock

1+ parts

$13.430

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40

$13.430

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A-Z Elektronik GmbH

Germany . 7,358 parts In-Stock

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7,358

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Corphita

USA . 4,955 parts In-Stock

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4,955

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Parana Technologies

USA . 1,598 parts In-Stock

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$3.868

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1,598

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$3.868

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Kepictronics

USA . 660 parts In-Stock

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660

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Overview

Elevate your designs with the TDA7333NTR from STMicroelectronics, a leader in innovative consumer IC solutions. This compact and reliable device guarantees exceptional performance across a variety of applications, from audio to automotive. With its robust industrial temperature range and superior build quality, you can trust the TDA7333NTR to deliver consistent results. Enhance your product’s value and reliability—choose STMicroelectronics for cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection against environmental factors, making the product suitable for various consumer applications.

Surface Mount: YES

Surface mount capability allows for compact designs and automated assembly, making it an ideal choice for modern electronic applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space, enabling easier integration into diverse circuit layouts.

General IC Type: CONSUMER CIRCUIT

As a consumer circuit IC, it is designed specifically for a broad range of consumer electronics, enhancing its versatility and usability.

Power Supplies (V): 3.3

Operating at a 3.3 V supply voltage strikes a balance between low power consumption and adequate performance, making it energy-efficient.

No. of Terminals: 16

With 16 terminals, the IC has sufficient connectivity options to integrate multiple functions, promoting design flexibility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile aid in space-saving designs, crucial for compact electronic devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in various environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this IC suitable for applications in harsh conditions, extending its usability.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances corrosion resistance and signal integrity, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positioning facilitates easier board layout and flexibility in component placement.

Maximum Seated Height: 1.2 mm

A low seated height of 1.2 mm contributes to a compact overall design, ideal for space-constrained applications.

Width: 4.4 mm

With a width of 4.4 mm, the IC can easily fit into narrow spaces, enhancing design options for PCB layout.

Minimum Supply Voltage (Vsup): 3 V

A minimum supply voltage of 3 V allows for compatibility with a range of low-power systems, making it more versatile.

Length: 5 mm

The 5 mm length complements its compact design, making it suitable for portable electronics.

Temperature Grade: INDUSTRIAL

Rated for industrial temperatures, this IC is built to withstand demanding operating conditions, ensuring stability and longevity.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, critical for efficient operation in consumer circuits.

Terminal Form: GULL WING

Gull wing terminals provide robust mechanical connections and ease of soldering, improving assembly reliability.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch is conducive to high-density board layouts, maximizing the efficiency of component placements.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this IC can withstand moderate levels of moisture exposure, making it robust for various environments.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V provides headroom for power supply variations, enhancing resource reliability.

Technical Specifications

Other Function Consumer ICs TDA7333NTR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

TDA7333NTR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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