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T410-800B

STMicroelectronics

T410-800B by STMicroelectronics

T410-800B by STMicroelectronics is a single TRIAC designed for AC applications, featuring a max RMS on-state current of 4 A and repetitive peak off-state voltage of 800 V. It operates b/w -40 °C to 110°C with a gate trigger current of 10 mA. Ideal for controlling power in lighting and motor circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,320 parts In-Stock

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11,320

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Anansix

USA . 641 parts In-Stock

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641

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Digiode

USA . 262 parts In-Stock

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262

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Distributors (Availability)

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$2.373

100+ parts

$2.159

1k+ parts

$1.946

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-

200

$2.373

$2.159

$1.946

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IDEA Electronic Components Group

UK . 1,330 parts In-Stock

1+ parts

$2.996

100+ parts

-

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$2.696

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1,330

$2.996

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$2.696

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MKK Technologies

India . 2,035 parts In-Stock

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$5.633

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2,035

$5.633

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DigiPath Technology Company

USA . 2,035 parts In-Stock

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$5.633

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2,035

$5.633

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AZTECH Wire

Italy . 67 parts In-Stock

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$10.200

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67

$10.200

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Component Stockers USA

USA . 570 parts In-Stock

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$99.990

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570

$99.990

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RC Electronics

USA . 77,000 parts In-Stock

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77,000

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Kepictronics

USA . 15,000 parts In-Stock

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15,000

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A-Z Elektronik GmbH

Germany . 7,017 parts In-Stock

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7,017

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Corphita

USA . 4,872 parts In-Stock

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4,872

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Parana Technologies

USA . 356 parts In-Stock

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$3.582

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356

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$3.582

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Overview

Elevate your designs with the T410-800B TRIAC from STMicroelectronics, where quality meets innovation. Renowned for their reliability, STMicroelectronics delivers a product that excels in controlling high-power AC loads seamlessly. With its robust performance across diverse applications—from lighting and heating controls to motor drives—it ensures efficient energy management while simplifying your circuits. Experience the blend of precision and durability that empowers your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental factors, making the TRIAC a reliable choice for various applications.

Maximum DC Gate Trigger Current: 10 mA

The low gate trigger current requirement allows for easy interfacing with microcontrollers and other low-power devices, enhancing flexibility in circuit design.

Configuration: SINGLE

A single configuration simplifies circuit design and integration, making it easier to implement in space-constrained applications.

Surface Mount: YES

The surface mount design allows for high-density PCB layouts and automated assembly processes, reducing manufacturing costs and time.

Package Shape: RECTANGULAR

A rectangular package shape is optimal for space utilization on PCBs, accommodating compact designs in electronic devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and facilitate easy soldering, ensuring reliable electrical connections.

Maximum Leakage Current: 0.01 mA

A low leakage current is crucial for applications where energy efficiency is a priority, helping to minimize power loss in circuits.

No. of Terminals: 2

Having just two terminals simplifies integration and reduces the complexity of the circuit, facilitating easier connections in designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for modern electronic devices, allowing for compact and lightweight designs.

Maximum Operating Temperature: 110 °C

A high operating temperature range indicates robust performance in demanding environments, making it suitable for various industrial applications.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4 quadrant trigger capability allows for versatile control of AC loads, making the TRIAC suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature ensures reliable performance in extreme conditions, broadening the scope of potential applications.

Terminal Finish: Matte Tin (Sn) - annealed

The annealed matte tin finish improves solderability and reduces oxidation, enhancing long-term reliability of the device.

Terminal Position: SINGLE

With a single terminal position, this TRIAC is straightforward to work with, reducing assembly time and complexity.

Maximum RMS On-state Current: 4 A

A maximum RMS current of 4 A allows for good handling of load currents in various residential and industrial applications.

Maximum DC Gate Trigger Voltage: 1.5 V

The low gate trigger voltage enhances compatibility with various control circuits, enabling effective triggering with minimal power.

Case Connection: MAIN TERMINAL 2

This specification indicates a straightforward connection for power applications, ensuring easy integration into existing systems.

Repetitive Peak Off-state Voltage: 800 V

A high off-state voltage rating means this TRIAC can handle demanding electrical environments and protect against voltage spikes.

Minimum Critical Rate of Rise of Off-state Voltage: 30 V/us

This specification helps in ensuring stable operation under sudden voltage changes, making it suitable for various high-speed applications.

Maximum Holding Current: 15 mA

A low holding current allows for greater energy efficiency, reducing power consumption in standby modes of operation.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds allows for compatibility with modern soldering processes, facilitating easier manufacturing.

Peak Reflow Temperature: 260 °C

The ability to withstand high reflow temperatures ensures reliability and durability during assembly, making it ideal for automated production lines.

Technical Specifications

Triode For Alternating Current (TRIAC) T410-800B attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

30 V/us

Maximum DC Gate Trigger Current:

10 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

15 mA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Maximum Leakage Current:

.01 mA

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Repetitive Peak Off-state Voltage:

800 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Device Type:

Trade Compliance

T410-800B Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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