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T410-600K

STMicroelectronics

T410-600K by STMicroelectronics

T410-600K by STMicroelectronics is a TRIAC with 600V repetitive peak off-state voltage, 4A max RMS on-state current, and 10mA max DC gate trigger current. It is used in applications requiring AC power control such as dimmer switches and motor speed control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,487 parts In-Stock

1+ parts

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2,487

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Anansix

USA . 1,270 parts In-Stock

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1,270

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Vyrian

USA . 446 parts In-Stock

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446

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,163 parts In-Stock

1+ parts

$3.354

100+ parts

-

1k+ parts

$3.019

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2,163

$3.354

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$3.019

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MKK Technologies

India . 996 parts In-Stock

1+ parts

$6.308

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996

$6.308

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DigiPath Technology Company

USA . 996 parts In-Stock

1+ parts

$6.308

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996

$6.308

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Perfect Parts

USA . 2,079 parts In-Stock

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2,079

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Parana Technologies

USA . 1,158 parts In-Stock

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$4.011

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1,158

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$4.011

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Cyclops Electronics Ltd (Excess)

UK . 928 parts In-Stock

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928

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Corphita

USA . 893 parts In-Stock

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893

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Overview

Unlock the power of efficient and reliable AC control with the T410-600K by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch quality with this TRIAC device. Ideal for a wide range of applications, this product offers customers exceptional value, benefits, and advantages. Experience seamless operation and superior performance with the T410-600K, making it the perfect choice for your electronics projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material ensures lightweight and durable construction, making it suitable for various applications.

Maximum DC Gate Trigger Current: 10 mA

The high maximum DC gate trigger current allows for reliable and efficient switching performance in a wide range of electrical applications.

Configuration: SINGLE

The single configuration simplifies the design and integration process, making it easy to use in various circuits.

Surface Mount: YES

Being surface mountable saves space and allows for more compact designs, ideal for modern electronics.

Package Shape: RECTANGULAR

The rectangular package shape offers easy mounting and handling, suitable for automated assembly processes.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering connections, ensuring reliable electrical contact.

No. of Terminals: 3

Having 3 terminals allows for versatile circuit configurations and connections.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers mechanical stability and easy mounting, making it suitable for industrial applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range ensures reliable performance in various environmental conditions.

Trigger Device Type: TRIAC

Being a TRIAC trigger device type provides bidirectional control of AC power, making it versatile for different applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows for operation in cold environments without compromising performance.

Maximum RMS On-state Current: 4 A

The high maximum RMS on-state current rating ensures the device can handle high power loads efficiently.

Maximum DC Gate Trigger Voltage: 1.5 V

The low maximum DC gate trigger voltage allows for easy and efficient control of the device with low gate voltage.

Case Connection: ISOLATED

Having an isolated case connection enhances safety and reduces the risk of electric shock in the application.

Repetitive Peak Off-state Voltage: 600 V

The high repetitive peak off-state voltage rating ensures the device can handle high voltage applications with ease.

Minimum Critical Rate of Rise of Commutation Voltage: 1.8 V/us

The minimum critical rate of rise of commutation voltage ensures fast and reliable switching performance.

Minimum Critical Rate of Rise of Off-state Voltage: 50 V/us

The minimum critical rate of rise of off-state voltage ensures efficient turn-off performance, reducing power dissipation.

Maximum Holding Current: 15 mA

The high maximum holding current ensures the device remains in the on-state mode reliably, enhancing overall system performance.

Technical Specifications

Triode For Alternating Current (TRIAC) T410-600K attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

1.8 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

50 V/us

Maximum DC Gate Trigger Current:

10 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

15 mA

JESD-30 Code:

R-PSFM-G3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

T410-600K Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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