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STY60NA20

STMicroelectronics

STY60NA20 by STMicroelectronics

STY60NA20 by STMicroelectronics is a N-CHANNEL FET with 200V DS Breakdown Voltage, 240A IDM, and 0.032 ohm RDS(on). Ideal for SWITCHING applications due to its 300W power dissipation, 150 °C max temp, and SINGLE configuration with built-in diode.

Median Price

$13.894

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 17 parts In-Stock

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$13.894

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$9.378

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Vyrian

USA . 4,232 parts In-Stock

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Anansix

USA . 1,576 parts In-Stock

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Digiode

USA . 825 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 200 parts In-Stock

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ComSIT Distribution GmbH

Germany . 60 parts In-Stock

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Lakeland Logistics Inc

USA . 17 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,109 parts In-Stock

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$1.520

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$1.368

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$1.520

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MKK Technologies

India . 1,468 parts In-Stock

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$2.858

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$2.858

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DigiPath Technology Company

USA . 1,468 parts In-Stock

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$2.858

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$2.858

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Kepictronics

USA . 3,500 parts In-Stock

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Corphita

USA . 2,782 parts In-Stock

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Parana Technologies

USA . 714 parts In-Stock

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$1.817

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Assy Fe

Spain . 16 parts In-Stock

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Overview

Looking for a reliable Power Field Effect Transistor (FET) that offers exceptional performance and durability? Look no further than the STY60NA20 by STMicroelectronics. With a maximum drain current of 60A and a minimum DS breakdown voltage of 200V, this N-channel transistor is perfect for switching applications. Its single configuration with a built-in diode ensures efficient operation, while the metal-oxide semiconductor technology guarantees high-quality performance. Trust STMicroelectronics for cutting-edge technology and superior components to meet all your power needs. Experience the difference with the STY60NA20 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the transistors, ensuring a longer lifespan and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics and lower resistance compared to P-channel FETs, making them suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protection against reverse voltage, making the transistor more versatile and convenient to use.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable operation in various electronic circuits.

Minimum DS Breakdown Voltage: 200 V

The high breakdown voltage allows for handling higher voltages, making this FET suitable for power applications where voltage spikes may occur.

Maximum Pulsed Drain Current (IDM): 240 A

The high pulsed drain current rating allows for handling sudden surges of current, making the FET suitable for high-power switching applications.

Avalanche Energy Rating (EAS): 3000 mJ

The high avalanche energy rating indicates the FET's ability to withstand high energy spikes, ensuring protection against voltage transients.

Maximum Power Dissipation (Abs): 300 W

The high power dissipation rating allows the FET to handle high power loads without overheating, ensuring reliable operation even under high power conditions.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows the FET to operate in a wide range of temperature environments, making it suitable for various applications.

Maximum Drain-Source On Resistance: 0.032 ohm

The low on-resistance ensures efficient power transfer and minimal power loss, making this FET suitable for high efficiency applications.

Technical Specifications

Power Field Effect Transistors (FET) STY60NA20 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

3000 mJ

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.032 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

240 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STY60NA20 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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