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STW75N20

STMicroelectronics

STW75N20 by STMicroelectronics

STW75N20 from STMicroelectronics is an N-channel FET ideal for switching applications, featuring a max drain current of 75 A and a breakdown voltage of 200 V. It has a low on-resistance of 0.034 Ω and operates up to 150 °C. This robust transistor is suitable for high-power circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,708 parts In-Stock

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8,708

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Digiode

USA . 4,615 parts In-Stock

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4,615

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Anansix

USA . 615 parts In-Stock

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615

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,474 parts In-Stock

1+ parts

$0.604

100+ parts

-

1k+ parts

$0.544

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1,474

$0.604

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$0.544

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MKK Technologies

India . 1,951 parts In-Stock

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$1.137

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1,951

$1.137

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DigiPath Technology Company

USA . 1,951 parts In-Stock

1+ parts

$1.137

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1,951

$1.137

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AZTECH Wire

Italy . 432 parts In-Stock

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$16.640

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432

$16.640

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QUARKTWIN TECHNOLOGY LTD

USA . 19,830 parts In-Stock

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19,830

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Alle Elektronik GmbH

Germany . 4,487 parts In-Stock

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4,487

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Corphita

USA . 4,049 parts In-Stock

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4,049

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Parana Technologies

USA . 530 parts In-Stock

1+ parts

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$0.723

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530

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$0.723

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Overview

Unlock unparalleled efficiency with the STW75N20 from STMicroelectronics, a leader in cutting-edge semiconductor solutions. This robust N-Channel Power FET delivers exceptional performance for demanding applications, ensuring reliable switching and power management. Built for durability and high current handling, it enhances your designs while reducing energy loss. Choose STMicroelectronics for quality you can trust and experience the benefits of superior technology in action!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliability and protection against environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency, making them ideal for high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode aids in clamping and reverse recovery, enhancing circuit protection and efficiency.

Transistor Application: SWITCHING

Designed specifically for switching applications, it provides fast response times and minimizes power loss.

Minimum DS Breakdown Voltage: 200 V

A high breakdown voltage ensures reliability in high-voltage applications, providing robust performance in challenging environments.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient PCB layout and space optimization in electronic designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and heat dissipation, making the device more resilient during operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for very low leakage currents when off, improving overall efficiency.

Maximum Pulsed Drain Current (IDM): 300 A

The high pulsed drain current capability is ideal for applications requiring short, high-current bursts, making it versatile for various designs.

Avalanche Energy Rating (EAS): 205 mJ

This rating indicates the transistor's ability to handle energy from voltage spikes, enhancing robustness in application circuits.

Maximum Drain Current (Abs) (ID): 75 A

The capability to handle 75 A ensures suitability for demanding applications while maintaining durability and performance.

No. of Terminals: 3

A simple 3-terminal design makes for easy integration and a compact footprint, simplifying circuit design.

Maximum Power Dissipation (Abs): 190 W

High power dissipation capacity allows the device to manage heat effectively, ensuring reliable performance under heavy load.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging eases installation while providing enhanced mechanical stability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for higher input impedance and low gate power consumption, making it suitable for high-efficiency applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating ensures the device can function reliably in demanding environments without failure.

Transistor Element Material: SILICON

Silicon is a standard semiconductor material that offers excellent performance and availability, making the device widely applicable.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring reliable electrical connections.

Maximum Drain Current (ID): 75 A

Reiterating the 75 A capability highlights the device's strength in handling substantial current loads efficiently.

Maximum Drain-Source On Resistance: 0.034 ohm

A low on-resistance ensures minimal power loss during operation, allowing for greater efficiency and reduced heat generation.

Terminal Position: SINGLE

Single terminal positioning simplifies layout and routing on the circuit board, enhancing ease of design.

Technical Specifications

Power Field Effect Transistors (FET) STW75N20 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

205 mJ

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

75 A

Maximum Drain-Source On Resistance:

.034 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

300 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW75N20 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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