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STW75N15

STMicroelectronics

STW75N15 by STMicroelectronics

STW75N15 by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 75 A, breakdown voltage of 150 V, and power dissipation up to 350 W. Ideal for high-efficiency power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,845 parts In-Stock

1+ parts

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4,845

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Vyrian

USA . 4,026 parts In-Stock

1+ parts

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4,026

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Anansix

USA . 1,701 parts In-Stock

1+ parts

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1,701

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,769 parts In-Stock

1+ parts

$1.637

100+ parts

-

1k+ parts

$1.473

10k+ parts

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1,769

$1.637

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$1.473

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MKK Technologies

India . 2,136 parts In-Stock

1+ parts

$3.078

100+ parts

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2,136

$3.078

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DigiPath Technology Company

USA . 2,136 parts In-Stock

1+ parts

$3.078

100+ parts

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2,136

$3.078

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Parana Technologies

USA . 2,281 parts In-Stock

1+ parts

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100+ parts

$1.957

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2,281

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$1.957

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Corphita

USA . 2,215 parts In-Stock

1+ parts

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2,215

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Overview

Unlock unparalleled efficiency and reliability with the STW75N15 from STMicroelectronics, a leader in innovation. This N-channel power FET is designed for seamless switching applications, delivering outstanding performance and durability. With its robust build and advanced technology, it ensures minimal energy loss and maximum output, making it ideal for everything from automotive to industrial systems. Experience exceptional value and peace of mind with STMicroelectronics' commitment to quality and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction offers excellent durability and resistance to physical stresses, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally provide higher performance and efficiency, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and increases reliability by reducing the need for additional components.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient operation and fast response times.

Minimum DS Breakdown Voltage: 150 V

A high breakdown voltage indicates the ability to handle significant voltage spikes, ensuring robustness in various environments.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient layout and design flexibility on PCBs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support, making them suitable for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low off-state current and high efficiency in power management.

Maximum Pulsed Drain Current (IDM): 300 A

This high pulsed drain current rating allows for handling significant transient loads without damage.

Maximum Drain Current (Abs) (ID): 75 A

A high maximum continuous drain current rating ensures the transistor can handle substantial power in your application.

No. of Terminals: 3

With only three terminals, this FET design is streamlined for easy integration into various circuits.

Maximum Power Dissipation (Abs): 350 W

A high power dissipation capacity allows for effective thermal management, enhancing performance and reliability.

Package Style (Meter): IN-LINE

In-line package styles are space-efficient and can be easily mounted on PCBs, optimizing design layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and quick switching times, excellent for modern electronic applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating ensures reliability in demanding environments and extends the product's lifecycle.

Transistor Element Material: SILICON

Silicon materials ensure the transistor offers good thermal stability and performance efficiency under various conditions.

Maximum Drain Current (ID): 75 A

The supported high drain current allows the device to be used in a variety of high-power applications.

Maximum Drain-Source On Resistance: 0.023 ohm

Low on-resistance ensures minimal power loss and heat generation, which increases efficiency and reliability in operation.

Terminal Position: SINGLE

A single terminal position simplifies layout and reduces complexity in circuit design.

Technical Specifications

Power Field Effect Transistors (FET) STW75N15 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

75 A

Maximum Drain-Source On Resistance:

.023 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

300 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW75N15 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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