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STW70N10F4

STMicroelectronics

STW70N10F4 by STMicroelectronics

STW70N10F4 from STMicroelectronics is an N-channel MOSFET ideal for switching applications, featuring a max drain current of 65 A and a breakdown voltage of 100 V. It offers low on-resistance at 0.0195 Ω and operates up to 175 °C. Its robust design ensures reliable performance in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,498 parts In-Stock

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3,498

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Digiode

USA . 1,202 parts In-Stock

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1,202

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Anansix

USA . 972 parts In-Stock

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972

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Avant Electronics Limited

UK . 70 parts In-Stock

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70

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IDEA Electronic Components Group

UK . 1,656 parts In-Stock

1+ parts

$1.423

100+ parts

-

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$1.281

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1,656

$1.423

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$1.281

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MKK Technologies

India . 997 parts In-Stock

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$2.676

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997

$2.676

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DigiPath Technology Company

USA . 997 parts In-Stock

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$2.676

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997

$2.676

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AZTECH Wire

Italy . 436 parts In-Stock

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$21.960

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436

$21.960

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Kepictronics

USA . 85,550 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Corphita

USA . 4,153 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,097 parts In-Stock

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3,097

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Parana Technologies

USA . 1,229 parts In-Stock

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$1.702

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$1.702

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Perfect Parts

USA . 515 parts In-Stock

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515

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GreenTree Electronics

Israel . 300 parts In-Stock

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Overview

Unlock unparalleled performance with the STW70N10F4 from STMicroelectronics, a trusted leader in cutting-edge technology. This N-channel Power FET excels in efficiency for various applications, delivering robust switching capabilities and superior thermal management. With its reliable construction and built-in diode, it ensures longevity and stability in demanding environments. Elevate your projects with this powerhouse and experience the value of quality you can depend on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight and cost-effective solution, making installation and handling easier.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors offer better performance in terms of on-resistance and efficiency, making them ideal for high-speed applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances reliability by providing protection against reverse polarity.

Transistor Application: SWITCHING

Optimized for switching applications, it provides fast response times and low energy loss, ideal for power management.

Minimum DS Breakdown Voltage: 100 V

A breakdown voltage of 100 V allows the transistor to handle higher voltages, making it suitable for demanding applications.

Package Shape: RECTANGULAR

The rectangular package shape offers ease of placement on PCBs and is beneficial for thermal management.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides robust connections and is preferred in applications that require durability and high power handling.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption when the transistor is off, increasing overall system efficiency.

Maximum Pulsed Drain Current (IDM): 260 A

The ability to handle 260 A pulsed current makes this FET exceptionally capable in transient load applications.

Avalanche Energy Rating (EAS): 120 mJ

A high avalanche energy rating indicates robustness during voltage spikes, enhancing reliability in harsh conditions.

Maximum Drain Current (Abs) (ID): 65 A

Handling up to 65 A allows for significant current management, making it suitable for high power applications.

No. of Terminals: 3

Three terminals simplify interfacing and connection to various circuit configurations.

Maximum Power Dissipation (Abs): 150 W

With a max power dissipation of 150 W, this FET can support high-power applications without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount design ensures secure mechanical attachment and improves thermal dissipation through better heat management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology results in faster switching speeds and lower power consumption, enhancing performance in digital circuits.

Maximum Operating Temperature: 175 °C

A high operating temperature of 175 °C ensures reliability under extreme conditions, suitable for industrial applications.

Transistor Element Material: SILICON

Silicon provides excellent thermal conductivity and reliability, making it the standard choice for power electronics.

Terminal Finish: Matte Tin (Sn)

Matte tin finish improves solderability and corrosion resistance, ensuring long-term reliability.

Maximum Drain Current (ID): 65 A

With a maximum drain current of 65 A, it supports demanding circuits that require consistent performance.

Maximum Drain-Source On Resistance: 0.0195 ohm

Low on-resistance minimizes power loss, enhancing efficiency and reducing heat generation in applications.

Terminal Position: SINGLE

Single terminal position allows for simplified design and easy integration into various PCB layouts.

Technical Specifications

Power Field Effect Transistors (FET) STW70N10F4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

120 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

65 A

Maximum Drain Current (ID):

65 A

Maximum Drain-Source On Resistance:

.0195 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

260 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW70N10F4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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