Loading...

STW55NM50N

STMicroelectronics

STW55NM50N by STMicroelectronics

STW55NM50N by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 500V breakdown voltage, 54A max drain current, and 350W power dissipation. Ideal for high-efficiency power management in various electronic devices.

Median Price

$23.283

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 300 parts In-Stock

1+ parts

$23.283

100+ parts

$20.596

1k+ parts

$19.092

10k+ parts

-

300

$23.283

$20.596

$19.092

-

Vyrian

USA . 8,203 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,203

-

-

-

-

Anansix

USA . 1,738 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,738

-

-

-

-

Digiode

USA . 1,627 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,627

-

-

-

-

Lakeland Logistics Inc

USA . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

300

-

-

-

-

Sunrise Surplus Inc.

USA . 45 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

45

-

-

-

-

Resion

USA . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6

-

-

-

-

Prism Electronics

USA . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,065 parts In-Stock

1+ parts

$1.501

100+ parts

-

1k+ parts

$1.351

10k+ parts

-

1,065

$1.501

-

$1.351

-

MKK Technologies

India . 702 parts In-Stock

1+ parts

$2.823

100+ parts

-

1k+ parts

-

10k+ parts

-

702

$2.823

-

-

-

DigiPath Technology Company

USA . 702 parts In-Stock

1+ parts

$2.823

100+ parts

-

1k+ parts

-

10k+ parts

-

702

$2.823

-

-

-

AZTECH Wire

Italy . 107 parts In-Stock

1+ parts

$15.290

100+ parts

-

1k+ parts

-

10k+ parts

-

107

$15.290

-

-

-

A-Z Elektronik GmbH

Germany . 7,380 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,380

-

-

-

-

Alle Elektronik GmbH

Germany . 3,653 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,653

-

-

-

-

Corphita

USA . 1,803 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,803

-

-

-

-

Parana Technologies

USA . 695 parts In-Stock

1+ parts

-

100+ parts

$1.795

1k+ parts

-

10k+ parts

-

695

-

$1.795

-

-

Perfect Parts

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Overview

Elevate your projects with the STW55NM50N from STMicroelectronics, a powerhouse N-channel FET designed for reliability and superior performance. With its robust switching capabilities and high breakdown voltage, this transistor ensures efficient operation across various applications—from industrial automation to renewable energy systems. Trust in STMicroelectronics’ legacy of excellence and innovation, providing you with unmatched quality and value to push your designs further.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides good protection against environmental factors while remaining lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs generally offer lower on-resistance and higher electron mobility, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the overall reliability by providing protection against reverse polarity, simplifying circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently operate in high-frequency circuits.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage ensures reliability in high-voltage applications, making it suitable for a range of industrial uses.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on circuit boards and simplifies integration.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide excellent mechanical stability and are easier to solder, making assembly more straightforward.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for low-power operation when off, which reduces power consumption and heat generation in devices.

Maximum Pulsed Drain Current (IDM): 216 A

The high maximum pulsed current rating supports demanding applications requiring significant transient performance.

Avalanche Energy Rating (EAS): 850 mJ

An impressive avalanche energy rating indicates good reliability under energy spikes, which helps in safeguarding circuits.

Maximum Drain Current (Abs) (ID): 54 A

This rating allows the FET to handle substantial current loads, making it versatile for various power applications.

No. of Terminals: 3

With three terminals, this FET simplifies design integration while ensuring essential functionality is accessible.

Maximum Power Dissipation (Abs): 350 W

High power dissipation capability allows the FET to handle significant power loads without overheating, ensuring durability.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides enhanced mechanical anchoring and heat dissipation, ensuring stable performance in applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for lower power consumption and faster switching speeds, making it suitable for modern electronic designs.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows this FET to function effectively in harsh environments without failure.

Transistor Element Material: SILICON

Silicon is a reliable and widely used semiconductor material, ensuring compatibility with many electronic applications.

Maximum Drain Current (ID): 54 A

This characteristic enables robust performance in high-current applications, which is critical for power electronics.

Maximum Drain-Source On Resistance: 0.054 ohm

Low on-resistance translates to higher efficiency and reduced heat loss during operation, enhancing overall system performance.

Terminal Position: SINGLE

A single terminal arrangement simplifies the PCB layout and minimizes space while ensuring effective operation.

Technical Specifications

Power Field Effect Transistors (FET) STW55NM50N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

850 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

54 A

Maximum Drain Current (ID):

54 A

Maximum Drain-Source On Resistance:

.054 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

216 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW55NM50N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20