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STV160NF03LT4

STMicroelectronics

STV160NF03LT4 by STMicroelectronics

STV160NF03LT4 by STMicroelectronics is a high-performance N-channel FET designed for efficient switching applications. It features a max drain current of 160 A, a breakdown voltage of 30 V, and low on-resistance of 0.0038 Ω. Ideal for power management in compact designs, it comes in a small outline package with gull-wing terminals.

Median Price

$3.125

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 87 parts In-Stock

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$3.125

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87

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$3.125

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Prism Electronics

USA . 10,200 parts In-Stock

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10,200

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Vyrian

USA . 6,751 parts In-Stock

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Digiode

USA . 3,802 parts In-Stock

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Anansix

USA . 2,361 parts In-Stock

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2,361

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Bristol Electronics

USA . 1,200 parts In-Stock

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Dan-Mar Components

USA . 1,200 parts In-Stock

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Inventory MP

USA . 851 parts In-Stock

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851

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ACDS - Activité Composants Distribution Service

France . 600 parts In-Stock

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600

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Cyclops Electronics Ltd

UK . 50 parts In-Stock

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50

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 328 parts In-Stock

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$1.772

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$1.595

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MKK Technologies

India . 1,863 parts In-Stock

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$3.332

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DigiPath Technology Company

USA . 1,863 parts In-Stock

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$3.332

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Component Stockers USA

USA . 322 parts In-Stock

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$99.990

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Perfect Parts

USA . 11,424 parts In-Stock

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Authorized Procurement Solutions

USA . 9,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,218 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,209 parts In-Stock

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Assy Fe

Spain . 2,999 parts In-Stock

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Kepictronics

USA . 980 parts In-Stock

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980

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Corphita

USA . 553 parts In-Stock

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553

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Parana Technologies

USA . 286 parts In-Stock

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$2.119

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Overview

Unlock exceptional performance with the STV160NF03LT4 from STMicroelectronics, a trusted leader in semiconductor innovation. This N-channel power FET is designed for versatile applications, offering seamless switching capabilities and robust reliability. Its compact, surface-mount design ensures easy integration into your projects, while its high efficiency and low on-resistance translate to reduced energy consumption. Elevate your designs with the quality and expertise that only STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection against environmental factors, making the FET suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency compared to P-channel units, making this device an effective choice for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances reliability and simplifies circuit design by reducing the need for external components.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently control power, making it ideal for use in modern power electronics.

Surface Mount: YES

Surface mount technology allows for compact designs, optimizing board space and enabling high-density electronics.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET is suitable for various high-voltage applications, enhancing circuit robustness.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient use of space, allowing for more straightforward placement on printed circuit boards.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve the reliability of connections in surface-mount applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows the FET to be fully off when the gate voltage is low, providing excellent control and reducing power consumption.

Maximum Pulsed Drain Current (IDM): 640 A

With a maximum pulsed drain current of 640 A, this FET can handle significant current surges, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 1000 mJ

An avalanche energy rating of 1000 mJ indicates strong performance under high-stress conditions, enhancing device reliability.

No. of Terminals: 10

The presence of 10 terminals allows for versatile connection options, supporting various circuit configurations.

Package Style (Meter): SMALL OUTLINE

A small outline package style is advantageous for space-constrained designs, promoting the miniaturization of electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology delivers high efficiency and fast switching speeds, making it ideal for modern electronics.

Transistor Element Material: SILICON

Silicon as the element material provides good thermal stability, ensuring reliable operation across a range of environmental conditions.

Maximum Drain Current (ID): 160 A

A maximum drain current of 160 A allows for robust performance in demanding applications, ensuring the FET can handle significant loads.

Maximum Drain-Source On Resistance: 0.0038 ohm

Ultra-low on-resistance minimizes power loss during operation, making this FET highly efficient for power management.

Terminal Position: DUAL

Dual terminal positions promote flexible layout options, which can enhance the design of complex circuits.

Case Connection: DRAIN

Connection at the drain enhances current handling and helps in maintaining thermal performance, which is critical in power applications.

Technical Specifications

Power Field Effect Transistors (FET) STV160NF03LT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1000 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

160 A

Maximum Drain-Source On Resistance:

.0038 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G10

No. of Elements:

1

No. of Terminals:

10

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

640 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STV160NF03LT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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