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STV160NF02L

STMicroelectronics

STV160NF02L by STMicroelectronics

STV160NF02L by STMicroelectronics is a powerful N-channel FET designed for efficient switching applications. It features a max drain current of 160 A, low on-resistance of 0.0035 Ω, and operates up to 175 °C. Ideal for high-performance power management in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 2,055 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,600 parts In-Stock

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1,600

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Bristol Electronics

USA . 1,600 parts In-Stock

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1,600

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Dan-Mar Components

USA . 1,600 parts In-Stock

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1,600

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Anansix

USA . 948 parts In-Stock

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948

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Digiode

USA . 180 parts In-Stock

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180

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ABC Electronics Ltd.

UK . 50 parts In-Stock

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50

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,131 parts In-Stock

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$0.538

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$0.484

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2,131

$0.538

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$0.484

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MKK Technologies

India . 575 parts In-Stock

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$1.012

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DigiPath Technology Company

USA . 575 parts In-Stock

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$1.012

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575

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Parana Technologies

USA . 1,256 parts In-Stock

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$0.644

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$0.644

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Corphita

USA . 318 parts In-Stock

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Overview

Unlock the power of efficiency with the STV160NF02L N-channel Power FET from STMicroelectronics! Renowned for their exceptional quality and innovation, STMicroelectronics delivers reliability you can trust. This versatile switching solution is perfect for demanding applications, ensuring optimal performance while minimizing energy losses. Experience enhanced thermal management and robust current handling that elevate your designs—choose the STV160NF02L for unmatched value and superior results!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance in terms of efficiency and speed, making them ideal for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode enhances circuit protection and simplifies design, reducing the need for additional components.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures effective performance and reliability in controlling power circuits.

Surface Mount: YES

Surface mount technology allows for smaller footprint designs and easier automated assembly, making it suitable for space-constrained applications.

Minimum DS Breakdown Voltage: 20 V

A minimum breakdown voltage of 20 V ensures this transistor can handle moderate voltage levels, making it versatile for various power applications.

Package Shape: RECTANGULAR

The rectangular shape aids in space-efficient layouts, making it easier to integrate into circuit boards.

Terminal Form: GULL WING

Gull wing terminals allow for reliable solder connections and easier visual inspection, enhancing assembly quality.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides high input impedance, reducing power loss and enabling efficient switching.

Maximum Pulsed Drain Current (IDM): 640 A

A high pulsed drain current capability of 640 A makes this FET suitable for applications requiring brief bursts of high power.

Avalanche Energy Rating (EAS): 330 mJ

An avalanche energy rating of 330 mJ suggests robustness against transient voltages, providing added reliability in demanding environments.

Maximum Drain Current (Abs): 160 A

The ability to handle a maximum drain current of 160 A makes this FET highly effective for high-power applications.

No. of Terminals: 10

Having 10 terminals allows for versatile circuit configurations and easier integration into various designs.

Maximum Power Dissipation (Abs): 160 W

A maximum power dissipation of 160 W means this FET can handle substantial power loads, making it ideal for power circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances space efficiency and is suitable for compact electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for higher switching speeds and greater efficiency compared to bipolar junction transistors.

Maximum Operating Temperature: 175 °C

A maximum operating temperature of 175 °C ensures that this FET can function reliably in high-temperature environments.

Transistor Element Material: SILICON

Silicon as the element material provides good thermal conductivity and performance, ensuring reliability and efficiency.

Maximum Drain Current (ID): 160 A

The max drain current capability of 160 A enhances the utility of the transistor in high-load applications.

Maximum Drain-Source On Resistance: 0.0035 ohm

A low on-resistance of 0.0035 ohm minimizes losses in the circuit, leading to increased efficiency and lower heat generation.

Terminal Position: DUAL

A dual terminal position supports flexible layout options for designers, enabling more efficient routing on circuit boards.

Case Connection: DRAIN

With a drain connection, this design facilitates effective heat dissipation and enhances the overall performance in a circuit.

Technical Specifications

Power Field Effect Transistors (FET) STV160NF02L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA-LOW RESISTANCE, FAST SWITCHING, LOW THRESHOLD

Avalanche Energy Rating (EAS):

330 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

160 A

Maximum Drain Current (ID):

160 A

Maximum Drain-Source On Resistance:

.0035 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G10

No. of Elements:

1

No. of Terminals:

10

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

640 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STV160NF02L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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