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STU70N2LH5

STMicroelectronics

STU70N2LH5 by STMicroelectronics

STU70N2LH5 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 48 A, a breakdown voltage of 25 V, and operates at up to 175 °C. Ideal for high-power circuits with low on-resistance (0.0104 Ω).

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,409 parts In-Stock

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2,409

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Vyrian

USA . 2,174 parts In-Stock

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Digiode

USA . 2,019 parts In-Stock

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2,019

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IDEA Electronic Components Group

UK . 368 parts In-Stock

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$0.349

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$0.314

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368

$0.349

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$0.314

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MKK Technologies

India . 2,315 parts In-Stock

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$0.656

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2,315

$0.656

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DigiPath Technology Company

USA . 2,315 parts In-Stock

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$0.656

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2,315

$0.656

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Alle Elektronik GmbH

Germany . 3,578 parts In-Stock

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3,578

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Corphita

USA . 3,527 parts In-Stock

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3,527

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Parana Technologies

USA . 1,496 parts In-Stock

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$0.417

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1,496

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$0.417

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Overview

Elevate your designs with the STU70N2LH5 from STMicroelectronics, a trusted leader in semiconductor innovation. This powerful N-channel MOSFET is perfect for efficient switching applications, delivering unmatched performance and reliability. With its compact design and built-in diode, it ensures seamless integration into various systems, from automotive to industrial controls. Experience superior quality and enhance your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides durability and resistance to environmental factors, making it a reliable option for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and efficiency in switching applications, making this product suitable for high-speed and high-efficiency designs.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode enhances circuit protection and simplifies design by reducing the need for additional components, thereby optimizing space and cost.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently manage power, making it ideal for use in motor control, power management, and other electronic circuits.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25V, this FET is suitable for a range of applications, ensuring robustness under varying electrical stresses.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient space utilization on printed circuit boards (PCBs), facilitating easier integration into compact electronic designs.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides solid mechanical and electrical connections, ensuring stable performance in demanding conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower on-resistance and better control of the drain current, contributing to overall efficiency in applications.

Maximum Pulsed Drain Current (IDM): 192 A

A high pulsed drain current capability of 192A makes this FET suitable for demanding applications requiring substantial current surges.

Maximum Drain Current (Abs) (ID): 48 A

The maximum continuous drain current rating of 48A ensures reliable performance in applications requiring sustained power handling.

No. of Terminals: 3

The 3-terminal design enables straightforward integration into circuits while providing essential connections for power and control.

Maximum Power Dissipation (Abs): 60 W

A power dissipation capability of 60W implies that this FET can handle significant power without overheating, ensuring dependable operation in various conditions.

Package Style (Meter): IN-LINE

The in-line package style provides ease of mounting and efficient layout on PCBs, simplifying assembly and reducing production costs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology is known for low on-resistance and high efficiency, making this FET suitable for high-speed switch applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this FET shows excellent thermal stability, making it suitable for high-temperature environments.

Transistor Element Material: SILICON

Silicon-based transistors are robust and cost-effective, providing good performance characteristics in a wide range of applications.

Maximum Drain Current (ID): 48 A

The consistent rating of maximum drain current at 48A highlights the reliability and stability of the FET during operation.

Maximum Drain-Source On Resistance: 0.0104 ohm

A low on-resistance of 0.0104 ohms ensures minimal power loss and high efficiency during operation, making it ideal for power-sensitive applications.

Terminal Position: SINGLE

The single terminal position streamlines connections in circuit designs, simplifying the integration process in both prototyping and production.

Case Connection: DRAIN

Direct drain connection enhances electrical performance and simplifies the flow of current, which is crucial for effective transistor operation.

Technical Specifications

Power Field Effect Transistors (FET) STU70N2LH5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

48 A

Maximum Drain Current (ID):

48 A

Maximum Drain-Source On Resistance:

.0104 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251AA

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

192 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STU70N2LH5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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