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STU7LNM60N

STMicroelectronics

STU7LNM60N by STMicroelectronics

STU7LNM60N by STMicroelectronics is an N-channel FET designed for switching applications. It features a 600V breakdown voltage, 18A pulsed drain current, and operates efficiently up to 150 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,677 parts In-Stock

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2,677

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Vyrian

USA . 2,364 parts In-Stock

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2,364

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Anansix

USA . 1,888 parts In-Stock

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1,888

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,336 parts In-Stock

1+ parts

$0.902

100+ parts

-

1k+ parts

$0.811

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2,336

$0.902

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$0.811

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MKK Technologies

India . 507 parts In-Stock

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$1.695

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507

$1.695

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DigiPath Technology Company

USA . 507 parts In-Stock

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$1.695

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507

$1.695

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Corphita

USA . 1,854 parts In-Stock

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1,854

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Parana Technologies

USA . 1,662 parts In-Stock

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$1.078

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1,662

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$1.078

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Overview

Unlock exceptional performance with the STU7LNM60N N-Channel Power FET from STMicroelectronics. Renowned for its reliability and cutting-edge technology, STMicroelectronics delivers a robust solution designed for efficient power management in various applications, including industrial automation and renewable energy systems. With impressive switching capabilities and built-in protection features, this transistor not only maximizes efficiency but also enhances system longevity, providing unmatched value for your projects. Embrace innovation and elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body ensures durability and resistance to environmental factors, making it suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel configuration allows for higher efficiency and better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design by providing inherent protection against reverse current.

Transistor Application: SWITCHING

Optimized for switching applications, this FET offers fast response times and reliable operation.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage enhances reliability in high-voltage applications, allowing for safer and more robust designs.

Package Shape: RECTANGULAR

The rectangular shape provides efficient use of PCB space, facilitating easier integration into various layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer enhanced mechanical stability and ease of soldering, ensuring durable connections.

Operating Mode: ENHANCEMENT MODE

The enhancement mode allows for high-performance switching, making this FET ideal for low-power applications.

Maximum Pulsed Drain Current (IDM): 18 A

The ability to handle high pulsed currents enhances performance in demanding switching scenarios.

Avalanche Energy Rating (EAS): 119 mJ

This rating indicates robustness against voltage transients, making it suitable for applications exposed to voltage spikes.

No. of Terminals: 3

A 3-terminal configuration simplifies integration into circuit designs while maintaining functionality.

Maximum Power Dissipation (Abs): 45 W

High power dissipation capability allows for effective thermal management, resulting in enhanced reliability.

Package Style (Meter): IN-LINE

In-line package style makes it easy to mount on PCBs, saving valuable space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides low input power requirements and high-speed switching capabilities.

Maximum Operating Temperature: 150 °C

A high operating temperature range increases versatility, allowing use in various thermal environments.

Transistor Element Material: SILICON

Silicon is a commonly used material in electronics, offering good electrical characteristics and reliability.

Minimum Operating Temperature: -55 °C

A wide temperature range ensures reliability in extreme conditions, making it suitable for automotive and industrial applications.

Maximum Drain Current (ID): 4.5 A

The FET can efficiently handle a respectable drain current, ensuring effective operation in practical applications.

Maximum Drain-Source On Resistance: 0.99 ohm

Low on-resistance minimizes power losses during operation, enhancing efficiency in switching applications.

Terminal Position: SINGLE

Single terminal positioning facilitates simpler designs and layouts for integration.

Case Connection: DRAIN

Providing a direct drain connection ensures effective heat dissipation and reliable operation.

Maximum Feedback Capacitance (Crss): 1.1 pF

Low feedback capacitance contributes to fast switching speeds, making it suitable for high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) STU7LNM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

119 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

4.5 A

Maximum Drain-Source On Resistance:

.99 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

1.1 pF

JEDEC-95 Code:

TO-251

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

18 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STU7LNM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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