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STT3P2UH7

STMicroelectronics

STT3P2UH7 by STMicroelectronics

STT3P2UH7 by STMicroelectronics is a P-CHANNEL FET with 20V DS Breakdown Voltage, 12A IDM, and 0.18 ohm RDS(on). It is used for SWITCHING applications in ENHANCEMENT MODE. The transistor features GULL WING terminals, operates at -55 °C to support various electronic devices.

Median Price

$0.134

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 14 parts In-Stock

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$0.144

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14

$0.144

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Future Electronics

Canada . 6,000 parts In-Stock

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$0.124

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$0.124

Chip1Stop

Japan . 14 parts In-Stock

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14

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Digiode

USA . 717 parts In-Stock

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$0.020

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717

$0.020

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EXC GmbH

Germany . 2,866 parts In-Stock

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$0.087

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2,866

$0.087

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Vyrian

USA . 3,702 parts In-Stock

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3,702

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Anansix

USA . 2,167 parts In-Stock

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Goldney Electronics S.L.

Spain . 20 parts In-Stock

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ComSIT USA

USA . 19 parts In-Stock

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Corphita

USA . 3,982 parts In-Stock

1+ parts

$0.019

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$0.019

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Component Stockers USA

USA . 4,432 parts In-Stock

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$0.090

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$0.090

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IDEA Electronic Components Group

UK . 266 parts In-Stock

1+ parts

$0.850

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$0.765

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266

$0.850

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$0.765

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MKK Technologies

India . 1,118 parts In-Stock

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$1.599

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$1.599

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DigiPath Technology Company

USA . 1,118 parts In-Stock

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$1.599

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$1.599

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AZTECH Wire

Italy . 832 parts In-Stock

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$9.110

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832

$9.110

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A-Z Elektronik GmbH

Germany . 8,825 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,292 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Parana Technologies

USA . 58 parts In-Stock

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$1.016

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58

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$1.016

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Overview

Elevate your power management solutions with the STT3P2UH7 by STMicroelectronics. Crafted with precision and expertise, this P-Channel Power Field Effect Transistor offers unparalleled reliability and performance in switching applications. Its single configuration with built-in diode ensures seamless operation, while the enhancement mode guarantees efficiency. With a maximum pulsed drain current of 12A and minimum DS breakdown voltage of 20V, this FET is designed to meet your power needs with ease. Trust STMicroelectronics to deliver quality components that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET.

Polarity or Channel Type: P-CHANNEL

Suitable for applications requiring P-channel FET characteristics.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode enhances the functionality of the FET for specific applications.

Transistor Application: SWITCHING

Optimized for switching operations, making it ideal for control circuits.

Surface Mount: YES

Ease of installation and space-saving design for PCB applications.

Minimum DS Breakdown Voltage: 20 V

Provides a safe operating voltage range for the FET.

Package Shape: RECTANGULAR

A common and practical shape for easy integration into circuit designs.

Terminal Form: GULL WING

Facilitates easy soldering and PCB mounting.

Operating Mode: ENHANCEMENT MODE

Allows for efficient control of the FET's conductivity.

Maximum Pulsed Drain Current (IDM): 12 A

High pulsed drain current capability for demanding applications.

No. of Terminals: 6

Provides multiple connection points for versatile circuit designs.

Package Style (Meter): SMALL OUTLINE

Compact design for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Reliable technology known for low power consumption and high performance.

Transistor Element Material: SILICON

Silicon-based material for improved thermal performance and reliability.

Minimum Operating Temperature: -55 °C

Capable of operating in low-temperature environments.

Maximum Drain Current (ID): 3 A

Sufficient drain current rating for various applications.

Maximum Drain-Source On Resistance: 0.18 ohm

Low on-resistance for efficient power handling.

Terminal Position: DUAL

Dual terminal position for flexible circuit connections.

Technical Specifications

Power Field Effect Transistors (FET) STT3P2UH7 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

3 A

Maximum Drain-Source On Resistance:

.18 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

12 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STT3P2UH7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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