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STS3DNF30L

STMicroelectronics

STS3DNF30L by STMicroelectronics

STS3DNF30L by STMicroelectronics is a N-CHANNEL FET with 2 elements and built-in diode. It has a min DS breakdown voltage of 30V, max pulsed drain current of 14A, and max power dissipation of 2W. Ideal for switching applications in small outline packages with operating temperature up to 150 °C.

Median Price

$0.703

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 34,397 parts In-Stock

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34,397

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Digiode

USA . 3,751 parts In-Stock

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3,751

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Vyrian

USA . 2,800 parts In-Stock

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2,800

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LIBRA Elektronik GmbH

Germany . 2,480 parts In-Stock

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2,480

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Anansix

USA . 2,084 parts In-Stock

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2,084

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Bristol Electronics

USA . 1,305 parts In-Stock

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$0.703

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$0.487

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1,305

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$0.487

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Microfarads

USA . 1,258 parts In-Stock

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1,258

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,441 parts In-Stock

1+ parts

$0.986

100+ parts

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$0.888

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1,441

$0.986

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$0.888

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MKK Technologies

India . 647 parts In-Stock

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$1.855

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647

$1.855

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DigiPath Technology Company

USA . 647 parts In-Stock

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$1.855

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647

$1.855

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Corphita

USA . 4,634 parts In-Stock

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Parana Technologies

USA . 420 parts In-Stock

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$1.179

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420

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Overview

Unlock the power of innovation with the STS3DNF30L by STMicroelectronics. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor (FET) offers unrivaled performance in switching applications. With a maximum pulsing drain current of 14A and a low on-resistance of 0.09ohm, this transistor is designed to deliver efficient and reliable operation. Whether you're in the automotive, industrial, or consumer electronics industry, the STS3DNF30L provides the perfect solution for your power management needs. Trust STMicroelectronics to elevate your designs and bring your projects to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-term reliability.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Allows for versatile applications and functionality with the built-in diode.

Transistor Application: SWITCHING

Ideal for use in switching applications, making it suitable for a variety of electronic devices.

Surface Mount: YES

Enables easy and efficient installation on circuit boards.

Maximum DS Breakdown Voltage: 30 V

Offers a high breakdown voltage, ensuring reliable performance under different operating conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for precise control and efficient use of power.

Maximum Pulsed Drain Current (IDM): 14 A

Capable of handling high current surges, making it suitable for demanding applications.

Maximum Drain Current (Abs) (ID): 3.5 A

Designed to handle continuous current flow efficiently.

Maximum Power Dissipation (Abs): 2 W

Efficient power dissipation capability ensures stable performance under varying load conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes advanced semiconductor technology for improved efficiency and performance.

Maximum Operating Temperature: 150 °C

Can operate effectively at high temperatures, making it suitable for industrial use.

Maximum Drain-Source On Resistance: 0.09 ohm

Low on-resistance minimizes power loss and heat generation, improving overall efficiency.

Technical Specifications

Power Field Effect Transistors (FET) STS3DNF30L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

LOW THRESHOLD

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

3.5 A

Maximum Drain Current (ID):

3.5 A

Maximum Drain-Source On Resistance:

.09 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Maximum Pulsed Drain Current (IDM):

14 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STS3DNF30L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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