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STS3C3F30L

STMicroelectronics

STS3C3F30L by STMicroelectronics

STS3C3F30L by STMicroelectronics is a versatile N/P-channel FET designed for efficient switching applications. It features a max drain current of 3.5 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Ideal for compact electronic designs with its surface mount configuration.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,980 parts In-Stock

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4,980

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Anansix

USA . 2,057 parts In-Stock

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2,057

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Digiode

USA . 822 parts In-Stock

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822

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,118 parts In-Stock

1+ parts

$1.361

100+ parts

-

1k+ parts

$1.225

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1,118

$1.361

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$1.225

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MKK Technologies

India . 1,919 parts In-Stock

1+ parts

$2.559

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1,919

$2.559

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DigiPath Technology Company

USA . 1,919 parts In-Stock

1+ parts

$2.559

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1,919

$2.559

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Metaverse IC Inc.

Canada . 85,000 parts In-Stock

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85,000

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Corphita

USA . 2,568 parts In-Stock

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2,568

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,259 parts In-Stock

1+ parts

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$1.627

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1,259

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$1.627

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Overview

Experience unmatched performance and reliability with the STS3C3F30L from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile N-channel and P-channel power FET is designed for efficient switching applications, providing enhanced durability in demanding environments. With its compact design and exceptional thermal management, it’s ideal for automotive, industrial, and consumer electronics. Elevate your projects with the quality and expertise that only STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures lightweight and durable construction, offering an effective barrier against environmental factors.

Polarity or Channel Type: N-CHANNEL AND P-CHANNEL

Dual-channel capability allows for versatile circuit designs, making it suitable for various applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The separate element design combined with built-in diodes provides additional functionality and reliability in switching applications.

Transistor Application: SWITCHING

Designed primarily for switching applications, this transistor offers high efficiency and effective control in electronic circuits.

Surface Mount: YES

Surface mount capability enables reduced PCB space requirements and simplifies the assembly process.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30V ensures safety and reliability in high-voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration into various circuit designs, optimizing layout options.

Terminal Form: GULL WING

Gull-wing terminals provide excellent solder joint reliability, enhancing connection stability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation improves performance in applications requiring high switching speeds and efficiency.

No. of Elements: 2

Having two elements allows for more complex configurations and improved performance in circuit designs.

Maximum Pulsed Drain Current (IDM): 14 A

A high maximum pulsed drain current rating makes this FET suitable for demanding applications requiring high transient current capacity.

Maximum Drain Current (Abs) (ID): 3.5 A

The absolute maximum drain current rating ensures reliable operation under specified conditions.

No. of Terminals: 8

With eight terminals, this FET offers flexibility in connections, facilitating various circuit designs.

Maximum Power Dissipation (Abs): 2 W

A maximum power dissipation rating of 2W allows for effective thermal management in high-performance applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps save space on printed circuit boards, which is crucial for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides lower power consumption and high switching speeds, benefiting high-frequency applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows for reliable performance in demanding environments.

Transistor Element Material: SILICON

Silicon as the element material ensures excellent electrical performance and thermal stability.

Maximum Drain Current (ID): 3.5 A (Duplicate Entry)

The reliable drain current rating is integral for operational integrity in circuit applications.

Maximum Drain-Source On Resistance: 0.09 ohm

The low on-resistance enhances efficiency by minimizing power loss during operation.

Terminal Position: DUAL

Dual terminal positioning provides flexibility for layout, simplifying integration into circuit designs.

Moisture Sensitivity Level (MSL): 3

Being at MSL 3 indicates the part can withstand certain levels of moisture, making it suitable for various production environments.

Technical Specifications

Power Field Effect Transistors (FET) STS3C3F30L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

3.5 A

Maximum Drain Current (ID):

3.5 A

Maximum Drain-Source On Resistance:

.09 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

Moisture Sensitivity Level (MSL):

3

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Maximum Pulsed Drain Current (IDM):

14 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STS3C3F30L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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