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STS2DPF80

STMicroelectronics

STS2DPF80 by STMicroelectronics

STS2DPF80 by STMicroelectronics is a P-channel MOSFET designed for efficient switching applications. It features an 80V breakdown voltage, max drain current of 2A, and operates at up to 150 °C. Ideal for compact power management in surface mount designs.

Median Price

$0.680

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 10,000 parts In-Stock

1+ parts

$0.680

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10,000

$0.680

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Cyclops Electronics Ltd

UK . 40,000 parts In-Stock

1+ parts

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40,000

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Vyrian

USA . 8,591 parts In-Stock

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8,591

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Digiode

USA . 2,268 parts In-Stock

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2,268

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Anansix

USA . 1,700 parts In-Stock

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1,700

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ACDS - Activité Composants Distribution Service

France . 106 parts In-Stock

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106

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 137 parts In-Stock

1+ parts

$1.703

100+ parts

-

1k+ parts

$1.533

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137

$1.703

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$1.533

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MKK Technologies

India . 1,515 parts In-Stock

1+ parts

$3.202

100+ parts

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1,515

$3.202

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DigiPath Technology Company

USA . 1,515 parts In-Stock

1+ parts

$3.202

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1,515

$3.202

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AZTECH Wire

Italy . 336 parts In-Stock

1+ parts

$19.060

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336

$19.060

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Component Stockers USA

USA . 470 parts In-Stock

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$99.990

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470

$99.990

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A-Z Elektronik GmbH

Germany . 6,273 parts In-Stock

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6,273

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Corphita

USA . 2,188 parts In-Stock

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2,188

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Perfect Parts

USA . 830 parts In-Stock

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830

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Parana Technologies

USA . 499 parts In-Stock

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$2.036

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499

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$2.036

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Cyclops Electronics Ltd (Excess)

UK . 106 parts In-Stock

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106

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Overview

Elevate your designs with the STS2DPF80 from STMicroelectronics, a premium P-channel power FET engineered for excellence. Its robust performance in switching applications makes it ideal for consumer electronics and automotive solutions. With STMicroelectronics' commitment to quality, this device ensures reliability and efficiency, empowering you to achieve superior results while optimizing power management. Experience the advantages of innovative technology that streamlines your projects and boosts productivity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy provides excellent protection against environmental factors, ensuring reliability and longevity in various applications.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are ideal for high-side switching applications, making this product suitable for a wide range of circuit designs.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The dual element configuration with built-in diodes enhances functionality and provides additional protection against back EMF in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast performance and efficiency, making it ideal for power management.

Surface Mount: YES

Surface mount technology allows for compact circuit designs and automates assembly processes, reducing overall manufacturing costs.

Minimum DS Breakdown Voltage: 80 V

An 80V breakdown voltage ensures reliability under high voltage conditions, suitable for applications in automotive and industrial environments.

Package Shape: RECTANGULAR

The rectangular package shape is optimized for space efficiency on PCBs, allowing for more compact layouts.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and are easier to solder, enhancing manufacturability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers high input impedance, reducing power loss in the off state and improving overall circuit efficiency.

No. of Elements: 2

Having two elements enables versatility in design, allowing for parallel use or different functionalities within the same package.

Maximum Pulsed Drain Current (IDM): 8 A

An 8A pulsed drain current capability allows the FET to handle significant load demands, making it suitable for power-hungry applications.

Maximum Drain Current (Abs) (ID): 2 A

The FET can continuously handle up to 2A, making it suitable for a variety of moderate power applications.

No. of Terminals: 8

With 8 terminals, this FET provides ample connectivity options for complex circuit designs and ensures flexibility in implementing multiple functions.

Maximum Power Dissipation (Abs): 2.5 W

A maximum power dissipation of 2.5W allows for effective thermal management, enhancing reliability in demanding applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style is advantageous for space-constrained applications, enabling design of more compact electronic assemblies.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures low on-state resistance, reducing heat generation and improving efficiency in power switching applications.

Maximum Operating Temperature: 150 °C

High operating temperature capability (up to 150 °C) ensures reliability in harsh environments and increases the range of applications.

Transistor Element Material: SILICON

Silicon is well-known for its excellent electrical properties, ensuring high-performance and stability in various electronic applications.

Maximum Drain Current (ID): 2 A

Doubled confirmation of the maximum drain current supports consistent performance metrics, ensuring reliability in product specifications.

Maximum Drain-Source On Resistance: 0.25 ohm

0.25 ohm on-resistance minimizes power losses during operation, enhancing the efficiency of power delivery in circuits.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout options on PCBs, facilitating easier integration into various designs.

Technical Specifications

Power Field Effect Transistors (FET) STS2DPF80 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

.25 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

8 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STS2DPF80 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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