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STS25N3LLH6

STMicroelectronics

STS25N3LLH6 by STMicroelectronics

STS25N3LLH6 from STMicroelectronics is an N-channel MOSFET ideal for switching applications. It features a max drain current of 22 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Its compact SO8 package ensures efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 1,956 parts In-Stock

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Vyrian

USA . 1,636 parts In-Stock

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1,636

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Anansix

USA . 105 parts In-Stock

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105

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 342 parts In-Stock

1+ parts

$0.516

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$0.465

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342

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MKK Technologies

India . 187 parts In-Stock

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$0.971

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187

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DigiPath Technology Company

USA . 187 parts In-Stock

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$0.971

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187

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Corphita

USA . 4,338 parts In-Stock

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Parana Technologies

USA . 1,965 parts In-Stock

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$0.617

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1,965

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Overview

Unlock unparalleled efficiency and reliability with the STS25N3LLH6 from STMicroelectronics. This top-tier power FET, expertly crafted in durable plastic/epoxy, seamlessly integrates into various applications, ensuring optimal performance in your designs. Enjoy benefits like high current handling and low on-resistance, making it perfect for robust switching needs. Trust STMicroelectronics’ commitment to quality and innovation to elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures lightweight and cost-effective packaging, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for higher efficiency and faster switching speeds, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and reduces component count, enhancing reliability.

Transistor Application: SWITCHING

Designed for switching applications, this FET can handle quick on/off states, ensuring efficient operation in power management.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly processes, improving manufacturing efficiency.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30V provides good tolerance against voltage spikes, ensuring durability and reliability in varied applications.

Package Shape: RECTANGULAR

The rectangular shape enhances PCB layout flexibility, accommodating various circuit designs and configurations.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint strength and ease of handling during assembly, promoting robust connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for lower gate thresholds, improving device performance in power regulation applications.

Maximum Pulsed Drain Current (IDM): 88 A

The ability to handle pulsed currents up to 88A makes this transistor capable of managing high-demand conditions without damage.

Maximum Drain Current (Abs) (ID): 22 A

With a maximum current rating of 22A, this FET is suitable for a range of applications, including power converters and motor controls.

No. of Terminals: 8

Having 8 terminals provides various connectivity options, which can facilitate complex circuits and applications.

Maximum Power Dissipation (Abs): 2.7 W

A power dissipation capacity of 2.7W ensures that this transistor can operate effectively under realistic load conditions without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained designs, allowing for more compact and efficient layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers lower on-resistance and faster switching speeds, making this FET a strong choice for efficient power management.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can perform reliably in high-temperature environments.

Transistor Element Material: SILICON

Silicon as the element material provides stability and efficiency, ensuring reliable performance in various applications.

Maximum Drain Current (ID): 22 A

Reiterating a maximum drain current of 22A shows the strong capabilities of this FET in handling considerable loads effectively.

Maximum Drain-Source On Resistance: 0.0032 ohm

A low on-resistance of 0.0032 ohm results in minimal power losses during operation, enhancing overall energy efficiency.

Terminal Position: DUAL

Dual terminal position allows for flexible layout arrangements and easier integration into various circuit designs.

Technical Specifications

Power Field Effect Transistors (FET) STS25N3LLH6 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.0032 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

88 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STS25N3LLH6 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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