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STS2DNF30L

STMicroelectronics

STS2DNF30L by STMicroelectronics

STS2DNF30L by STMicroelectronics is an N-CHANNEL FET with 30V DS Breakdown Voltage, 9A IDM, and 0.15 ohm RDS. It's used for SWITCHING applications in a SMALL OUTLINE package with GULL WING terminals.

Median Price

$0.630

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,482 parts In-Stock

1+ parts

$1.010

100+ parts

$0.413

1k+ parts

$0.294

10k+ parts

$0.234

1,482

$1.010

$0.413

$0.294

$0.234

Avnet

USA . 10,000 parts In-Stock

1+ parts

-

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10,000

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EBV Elektronik

Germany . 2,500 parts In-Stock

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2,500

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DigiKey

USA . 815 parts In-Stock

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$0.251

815

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-

$0.251

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.424

100+ parts

-

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10

$0.424

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Digiode

USA . 203 parts In-Stock

1+ parts

$0.836

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203

$0.836

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Cyclops Electronics Ltd

UK . 46,784 parts In-Stock

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Chip Stock

USA . 35,140 parts In-Stock

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35,140

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IBS Electronics

USA . 10,000 parts In-Stock

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$0.309

10,000

-

-

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$0.309

Anansix

USA . 2,693 parts In-Stock

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2,693

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Vyrian

USA . 2,516 parts In-Stock

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2,516

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R&J Components

USA . 2,000 parts In-Stock

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2,000

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ComSIT Distribution GmbH

Germany . 1,875 parts In-Stock

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1,875

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ComSIT USA

USA . 1,875 parts In-Stock

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1,875

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Sensible Micro Corp

USA . 476 parts In-Stock

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476

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,732 parts In-Stock

1+ parts

$0.381

100+ parts

-

1k+ parts

$0.343

10k+ parts

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1,732

$0.381

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$0.343

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$0.416

100+ parts

-

1k+ parts

$0.399

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100

$0.416

-

$0.399

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Continental Prestige Electronics

USA . 3,517 parts In-Stock

1+ parts

$0.424

100+ parts

-

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-

10k+ parts

$0.416

3,517

$0.424

-

-

$0.416

Argo Parts USA

USA . 3,175 parts In-Stock

1+ parts

$0.424

100+ parts

-

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$0.412

3,175

$0.424

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-

$0.412

MKK Technologies

India . 989 parts In-Stock

1+ parts

$0.716

100+ parts

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989

$0.716

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DigiPath Technology Company

USA . 989 parts In-Stock

1+ parts

$0.716

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989

$0.716

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Ampacity Inc.

Singapore . 2,301 parts In-Stock

1+ parts

$0.750

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2,301

$0.750

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Corphita

USA . 4,435 parts In-Stock

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$0.792

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$0.792

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$2.222

100+ parts

$2.022

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$1.822

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2,000

$2.222

$2.022

$1.822

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RC Electronics

USA . 85,059 parts In-Stock

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Lixinc

USA . 4,427 parts In-Stock

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Kepictronics

USA . 3,600 parts In-Stock

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Epart123

USA . 2,500 parts In-Stock

1+ parts

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$0.750

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$0.750

2,500

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$0.750

$0.750

A-Z Elektronik GmbH

Germany . 1,710 parts In-Stock

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1,710

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Assy Fe

Spain . 1,040 parts In-Stock

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Parana Technologies

USA . 599 parts In-Stock

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$0.455

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599

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$0.455

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Overview

Unleash the power of innovation with the STS2DNF30L by STMicroelectronics. As a leader in semiconductor technology, STMicroelectronics delivers top-quality Power Field Effect Transistors that excel in switching applications. With a maximum pulsed drain current of 9A and a minimum DS breakdown voltage of 30V, this N-channel transistor offers exceptional performance and reliability. Whether you're designing consumer electronics or industrial systems, the STS2DNF30L provides the value, benefits, and advantages you need to take your projects to the next level. Trust STMicroelectronics to bring your ideas to life with cutting-edge technology and unmatched quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting and reliable.

Maximum Dropout Voltage-1: 0.14 V

Ensures minimal voltage drop between input and output, resulting in efficient power conversion.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Operating Temperature (TJ-Max): 125 °C

Can operate in high temperature environments without compromising performance.

Minimum Output Voltage-2: 2.45 V

Provides stable output voltage for connected devices, ensuring proper functionality.

Technology: CMOS

Utilizes advanced CMOS technology for efficient power regulation and low power consumption.

Nominal Output Voltage-2: 2.5 V

Offers a consistent output voltage for consistent performance of connected devices.

Package Shape: RECTANGULAR

Compact and space-saving design, ideal for applications where space is limited.

Terminal Form: GULL WING

Provides secure connection to the circuit board, reducing the risk of disconnection.

Operating Temperature (TJ-Min): -40 °C

Can withstand low temperatures, making it suitable for a wide range of operating conditions.

Packing Method: TUBE

Convenient packaging for storage, transportation, and assembly of the product.

Minimum Output Voltage-1: 3.234 V

Ensures consistent and accurate voltage output for connected devices.

Maximum Voltage Tolerance: 2 %

Provides precise voltage regulation, ensuring the stability of connected devices.

Nominal Output Voltage-1: 3.3 V

Standard output voltage suitable for a wide range of electronic devices.

No. of Terminals: 20

Offers multiple connection points for versatile applications and configurations.

Terminal Pitch: 0.65 mm

Compact terminal spacing for efficient PCB design and layout.

Adjustability: FIXED

Set output voltages for specific applications, eliminating the need for manual adjustments.

Maximum Operating Temperature: 125 °C

Maintains stable performance even in high-temperature environments.

Maximum Output Voltage-1: 3.366 V

Provides a slightly higher output voltage for devices that require a higher voltage input.

Moisture Sensitivity Level (MSL): 2

Designed to withstand moderate levels of moisture, ensuring reliability in humid conditions.

Width: 4.4 mm

Compact design for space-efficient integration into electronic devices.

Maximum Output Voltage-2: 2.55 V

Offers a lower output voltage option for devices with lower voltage requirements.

Maximum Output Current-1: 0.25 A

Delivers sufficient power for devices with higher current demands, ensuring reliable performance.

No. of Outputs: 2

Provides multiple output connections for powering multiple devices simultaneously.

Maximum Input Voltage: 6 V

Accepts a wide range of input voltages for versatility in various electronic applications.

Technical Specifications

Power Field Effect Transistors (FET) STS2DNF30L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

3 A

Maximum Drain Current (ID):

3 A

Maximum Drain-Source On Resistance:

.15 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Maximum Pulsed Drain Current (IDM):

9 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STS2DNF30L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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