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STS1HNK60

STMicroelectronics

STS1HNK60 by STMicroelectronics

STS1HNK60 by STMicroelectronics is an N-channel FET designed for switching applications, featuring a 600V breakdown voltage and 0.3A max drain current. It comes in a compact rectangular package with gull-wing terminals. This MOSFET operates efficiently at up to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Prism Electronics

USA . 161,018 parts In-Stock

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161,018

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Vyrian

USA . 8,286 parts In-Stock

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8,286

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J2 Sourcing AB

Sweden . 2,500 parts In-Stock

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2,500

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Digiode

USA . 1,489 parts In-Stock

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1,489

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Anansix

USA . 1,379 parts In-Stock

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1,379

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Bristol Electronics

USA . 20 parts In-Stock

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20

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Flex Direct, LLC

USA . 20 parts In-Stock

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20

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 748 parts In-Stock

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$0.822

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-

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$0.739

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748

$0.822

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$0.739

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MKK Technologies

India . 78 parts In-Stock

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$1.545

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78

$1.545

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DigiPath Technology Company

USA . 78 parts In-Stock

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$1.545

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78

$1.545

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AZTECH Wire

Italy . 1,052 parts In-Stock

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$21.740

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$21.740

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Component Stockers USA

USA . 426 parts In-Stock

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$99.990

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Perfect Parts

USA . 404,340 parts In-Stock

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GreenTree Electronics

Israel . 200,000 parts In-Stock

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Kepictronics

USA . 182,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,318 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,457 parts In-Stock

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Corphita

USA . 3,275 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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S.R.D Solutions

India . 1,400 parts In-Stock

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Parana Technologies

USA . 1,292 parts In-Stock

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$0.982

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1,292

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$0.982

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Overview

Unlock the potential of your designs with the STS1HNK60 by STMicroelectronics—a premier choice in small signal FETs that combines quality and reliability. Backed by a trusted manufacturer, this N-channel transistor excels in switching applications, delivering robust performance even at high temperatures. Its compact size and surface-mount capability make it ideal for modern electronics, enhancing efficiency while simplifying integration. Experience unmatched value and elevate your projects with STMicroelectronics' innovative solutions!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components, making the transistor reliable in various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are typically more efficient and offer better performance for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode offers additional protection and enhances the versatility of the transistor in various applications.

Transistor Application: SWITCHING

Designed for switching applications, this FET is ideal for power management circuits, allowing for high efficiency and speedy operation.

Surface Mount: YES

Surface mount technology allows for compact circuit designs, providing flexibility and saving space on PCBs.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage ensures this FET can handle demanding applications without risk of failure, enhancing its reliability.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout space on boards while allowing for efficient thermal management.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering to PCBs, improving assembly efficiency and reducing manufacturing costs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode ensures that the transistor only conducts when a suitable gate voltage is applied, enhancing control over circuit operation.

Maximum Drain Current (Abs) (ID): 0.3 A

This rating ensures adequate current handling for low to medium power applications, making it suitable for a variety of designs.

No. of Terminals: 8

The eight terminals offer multiple connection possibilities, increasing design flexibility in various applications.

Maximum Power Dissipation (Abs): 2 W

A maximum power dissipation of 2 W facilitates efficient operation, reducing the risks of overheating during use.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to compact designs which are ideal for modern electronic applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides excellent switching characteristics and low power consumption, ideal for high-performance circuits.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C enables the FET to function reliably in high-temperature environments.

Transistor Element Material: SILICON

Silicon as the element material ensures good electrical performance and cost-effectiveness, widely used in various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish enhances conductivity and improves solderability, ensuring reliable electrical connections.

Maximum Drain Current (ID): 0.3 A

Reiterating the 0.3 A maximum drain current, this capability ensures short and efficient transient handling in circuits.

Maximum Drain-Source On Resistance: 8.5 ohm

Low on-resistance minimizes power losses and improves the transistor's efficiency in switching applications.

Terminal Position: DUAL

The dual terminal position can facilitate better layout options in circuit design, enhancing connectivity.

Technical Specifications

Small Signal Field Effect Transistors (FET) STS1HNK60 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

.3 A

Maximum Drain Current (ID):

.3 A

Maximum Drain-Source On Resistance:

8.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STS1HNK60 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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