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STS1HNC60

STMicroelectronics

STS1HNC60 by STMicroelectronics

STS1HNC60 by STMicroelectronics is a single N-channel FET designed for switching applications. It features a 600V breakdown voltage, 0.36A max drain current, and operates at up to 150 °C. Ideal for compact designs with its gull-wing surface mount package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,882 parts In-Stock

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1,882

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Anansix

USA . 1,514 parts In-Stock

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1,514

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Digiode

USA . 455 parts In-Stock

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455

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 788 parts In-Stock

1+ parts

$1.748

100+ parts

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1k+ parts

$1.573

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788

$1.748

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$1.573

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MKK Technologies

India . 534 parts In-Stock

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$3.287

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534

$3.287

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DigiPath Technology Company

USA . 534 parts In-Stock

1+ parts

$3.287

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534

$3.287

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Corphita

USA . 1,791 parts In-Stock

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1,791

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Parana Technologies

USA . 1,619 parts In-Stock

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$2.090

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1,619

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$2.090

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Overview

Elevate your designs with the STS1HNC60 from STMicroelectronics—a leading name in semiconductor innovation. This N-channel FET delivers exceptional efficiency and reliability for switching applications, ensuring robust performance even in demanding environments. With its compact design and integrated diode, it simplifies your circuitry while enhancing thermal management. Trust in STMicroelectronics' commitment to quality and innovation, and unlock new possibilities for your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package offers excellent durability and is well-suited for a range of environmental conditions, making it reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional protection against reverse polarity and improves overall device robustness.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast response times and efficient operation.

Surface Mount: YES

Surface mount capability allows for compact design and easier integration into modern PCB layouts.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage ensures the transistor can handle high-voltage applications safely, enhancing its versatility.

Package Shape: RECTANGULAR

The rectangular shape is efficient for heat dissipation while allowing for space-saving designs on PCBs.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering contact, ensuring reliable connections and easier handling during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode provides improved performance characteristics and allows for efficient control in digital circuits.

Maximum Drain Current (Abs) (ID): 0.36 A

A maximum drain current of 0.36 A makes this FET suitable for a variety of low to moderate power applications.

No. of Terminals: 8

The 8-terminal configuration allows for versatile connections and makes it compatible with various circuit designs.

Maximum Power Dissipation (Abs): 2.5 W

With a maximum power dissipation of 2.5 W, this FET is capable of efficiently handling power without overheating in typical applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style is compact, enabling higher component density and more efficient use of PCB real estate.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures low power consumption and high-speed switching capabilities, making it ideal for modern electronic applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C allows for operation in harsher thermal environments, extending the application range.

Transistor Element Material: SILICON

Silicon as the element material enhances thermal stability and performance in FET applications.

Maximum Drain Current (ID): 0.36 A

Reiterating the maximum drain current, this feature reinforces the device's ability to provide adequate current in multiple applications.

Maximum Drain-Source On Resistance: 8 ohm

Low on-resistance improves efficiency by minimizing power loss during operation, making the FET more energy-efficient.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB design options and simplifies circuit integration.

Technical Specifications

Small Signal Field Effect Transistors (FET) STS1HNC60 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

.36 A

Maximum Drain Current (ID):

.36 A

Maximum Drain-Source On Resistance:

8 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STS1HNC60 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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