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STP7N52K3

STMicroelectronics

STP7N52K3 by STMicroelectronics

STP7N52K3 by STMicroelectronics is an N-channel FET designed for switching applications. It features a max drain current of 6.3 A, a breakdown voltage of 525 V, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,970 parts In-Stock

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6,970

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ComSIT Distribution GmbH

Germany . 2,000 parts In-Stock

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2,000

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Anansix

USA . 1,465 parts In-Stock

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1,465

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Digiode

USA . 1,282 parts In-Stock

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1,282

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Flip Electronics

USA . 1,200 parts In-Stock

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1,200

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$0.608

100+ parts

$0.553

1k+ parts

$0.499

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-

150

$0.608

$0.553

$0.499

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IDEA Electronic Components Group

UK . 1,320 parts In-Stock

1+ parts

$1.106

100+ parts

-

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$0.995

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1,320

$1.106

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$0.995

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MKK Technologies

India . 169 parts In-Stock

1+ parts

$2.079

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169

$2.079

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DigiPath Technology Company

USA . 169 parts In-Stock

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$2.079

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169

$2.079

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AZTECH Wire

Italy . 822 parts In-Stock

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$18.680

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822

$18.680

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Component Stockers USA

USA . 479 parts In-Stock

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$99.990

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479

$99.990

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Kepictronics

USA . 61,900 parts In-Stock

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61,900

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Epart123

USA . 27,950 parts In-Stock

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$0.290

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$0.290

27,950

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$0.290

$0.290

GreenTree Electronics

Israel . 27,950 parts In-Stock

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27,950

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Alle Elektronik GmbH

Germany . 3,995 parts In-Stock

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3,995

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Perfect Parts

USA . 3,629 parts In-Stock

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3,629

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Corphita

USA . 2,247 parts In-Stock

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2,247

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Parana Technologies

USA . 1,121 parts In-Stock

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$1.322

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1,121

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$1.322

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Overview

Elevate your projects with the STP7N52K3 from STMicroelectronics, a leading name in high-quality semiconductor solutions. This N-channel Power FET combines exceptional efficiency and reliability, making it ideal for demanding switching applications. With its robust design and superior performance, it ensures resilient operation in various environments. Experience enhanced power management and efficiency that elevate your designs, backed by STMicroelectronics' commitment to innovation and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides durability and resistance to environmental factors, ensuring reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher efficiency and faster switching speeds compared to P-channel devices, making this product suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and adds protection against voltage spikes, making this FET ideal for efficient switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures rapid response times, which are critical in applications like power supplies and motor control.

Minimum DS Breakdown Voltage: 525 V

With a high breakdown voltage, this FET can handle high voltages, expanding its usability in demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape improves thermal management and space utilization on printed circuit boards, providing a compact solution.

Terminal Form: THROUGH-HOLE

Through-hole terminal form ensures reliable mechanical and electrical connections, making this FET easy to assemble in various designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower gate drive requirements, which can lead to overall power efficiency in most switch-mode applications.

Maximum Pulsed Drain Current (IDM): 25 A

The high pulsed drain current capability allows this FET to handle demanding transients, making it a versatile choice for diverse applications.

Maximum Drain Current (Abs) (ID): 6.2 A

A maximum drain current rating of 6.2 A provides flexibility in design, making it suitable for various loads.

No. of Terminals: 3

The simple three-terminal design facilitates easy integration into circuits, ensuring convenient usage and versatility.

Maximum Power Dissipation (Abs): 90 W

High power dissipation capability ensures the FET can operate effectively under high-load conditions without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging allows for secure mounting on heatsinks or circuit boards, enhancing thermal dissipation and stability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and fast switching speeds, making the transistor highly efficient and responsive.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature increases reliability in harsh environments, allowing for broader application potential.

Transistor Element Material: SILICON

Silicon as the transistor element material ensures good performance characteristics, including speed and thermal stability.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and helps prevent corrosion, ensuring long-term performance and reliability of connections.

Maximum Drain Current (ID): 6.3 A

The slightly higher maximum drain current rating of 6.3 A offers even more flexibility for varying load conditions.

Maximum Drain-Source On Resistance: 0.98 ohm

Low on-resistance minimizes power loss during operation, contributing to greater efficiency and cooler operation in power applications.

Terminal Position: SINGLE

Single terminal position simplifies the design process and makes layout easier, aiding in efficient circuit assembly.

Technical Specifications

Power Field Effect Transistors (FET) STP7N52K3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

525 V

Maximum Drain Current (Abs) (ID):

6.2 A

Maximum Drain Current (ID):

6.3 A

Maximum Drain-Source On Resistance:

.98 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

25 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP7N52K3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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