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STP4NK50ZD

STMicroelectronics

STP4NK50ZD by STMicroelectronics

STP4NK50ZD by STMicroelectronics is an N-channel FET ideal for switching applications, featuring a 500V breakdown voltage and 12A pulsed drain current. It operates in enhancement mode with a max power dissipation of 45W. This versatile transistor is suitable for high-temperature environments up to 150 °C.

Median Price

$4.905

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Master Electronics

USA . 6,015 parts In-Stock

1+ parts

-

100+ parts

$1.350

1k+ parts

$0.549

10k+ parts

$0.497

6,015

-

$1.350

$0.549

$0.497

Chip1Stop

Japan . 6,015 parts In-Stock

1+ parts

-

100+ parts

$8.460

1k+ parts

$7.640

10k+ parts

-

6,015

-

$8.460

$7.640

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rapid Electronics

USA . 6,015 parts In-Stock

1+ parts

-

100+ parts

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6,015

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Digiode

USA . 4,561 parts In-Stock

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4,561

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Vyrian

USA . 3,735 parts In-Stock

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3,735

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Anansix

USA . 1,104 parts In-Stock

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1,104

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First Choice Components Inc.

USA . 1,000 parts In-Stock

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1,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,244 parts In-Stock

1+ parts

$0.546

100+ parts

-

1k+ parts

$0.492

10k+ parts

-

1,244

$0.546

-

$0.492

-

MKK Technologies

India . 1,249 parts In-Stock

1+ parts

$1.028

100+ parts

-

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1,249

$1.028

-

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DigiPath Technology Company

USA . 1,249 parts In-Stock

1+ parts

$1.028

100+ parts

-

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-

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1,249

$1.028

-

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Andel Nordic

Denmark . 2,386 parts In-Stock

1+ parts

$4.226

100+ parts

-

1k+ parts

$4.057

10k+ parts

$4.057

2,386

$4.226

-

$4.057

$4.057

AZTECH Wire

Italy . 1,190 parts In-Stock

1+ parts

$8.480

100+ parts

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1,190

$8.480

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Perfect Parts

USA . 13,216 parts In-Stock

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13,216

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Kepictronics

USA . 5,035 parts In-Stock

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RC Electronics

USA . 2,700 parts In-Stock

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2,700

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Alle Elektronik GmbH

Germany . 1,702 parts In-Stock

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1,702

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A-Z Elektronik GmbH

Germany . 1,511 parts In-Stock

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1,511

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Corphita

USA . 1,265 parts In-Stock

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1,265

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Parana Technologies

USA . 656 parts In-Stock

1+ parts

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100+ parts

$0.653

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656

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$0.653

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Overview

Elevate your projects with the STP4NK50ZD from STMicroelectronics, a trusted leader in semiconductor technology. This N-channel power FET is designed for efficient switching applications, delivering reliable performance and durability. With superior thermal management and robust breakdown voltage, it ensures optimal operation even in demanding conditions. Experience unmatched quality and innovation, making your designs more efficient and effective—empowering your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy packaging ensures durability and resistance to environmental factors, making it a reliable choice for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher efficiency and better performance in switching applications, making this product suitable for various electronic designs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides protection against reverse voltage scenarios, enhancing the longevity and reliability of circuits that utilize this FET.

Transistor Application: SWITCHING

Designed for switching applications, this FET is ideal for controlling power efficiently in various electronic circuits.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage of 500 V makes this transistor suitable for high-voltage applications, ensuring safe and reliable operation under demanding conditions.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout in PCB designs, optimizing space and ensuring effective connections.

Terminal Form: THROUGH-HOLE

Through-hole mounting allows for solid mechanical support and reliable electrical connections, making this FET versatile for various mounting needs.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for higher performance in terms of switching speeds and power efficiency, making it suitable for high-frequency applications.

Maximum Pulsed Drain Current (IDM): 12 A

A maximum pulsed drain current of 12 A indicates robust performance under peak conditions, which is beneficial for applications requiring intermittent high-load conditions.

Avalanche Energy Rating (EAS): 120 mJ

An avalanche energy rating of 120 mJ enhances the ability to withstand transient load conditions, ensuring reliability in harsh environments.

Maximum Drain Current (Abs) (ID): 3 A

The capability to handle up to 3 A allows for versatility in powering various electronic circuits, suited to moderate current requirements.

No. of Terminals: 3

Three terminals simplify circuit design while providing adequate control capabilities in a compact layout.

Maximum Power Dissipation (Abs): 45 W

With a maximum power dissipation of 45 W, this FET can handle significant power loads, making it a robust choice for demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging ensures easy installation and stability on PCBs, enhancing the overall usability of the product.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

As a MOS FET, it offers high input impedance and fast switching capabilities, making it a great choice for modern electronic circuits.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C ensures this FET remains reliable in high-heat environments, extending its usability in various applications.

Transistor Element Material: SILICON

Silicon-based technology is well-established and provides excellent performance characteristics, leading to trusted reliability in applications.

Terminal Finish: Matte Tin (Sn)

Matte tin terminal finish enhances solderability and provides a good corrosion-resistant layer, improving the longevity and reliability of connections.

Maximum Drain Current (ID): 3 A

The maximum drain current rating of 3 A accommodates a variety of applications, allowing flexibility in design choices.

Maximum Drain-Source On Resistance: 2.7 ohm

A low on-resistance of 2.7 ohms contributes to reduced power losses, improving efficiency in power management applications.

Terminal Position: SINGLE

A single terminal position simplifies the design process, facilitating easier integration into various circuit configurations.

Technical Specifications

Power Field Effect Transistors (FET) STP4NK50ZD attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

120 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

3 A

Maximum Drain Current (ID):

3 A

Maximum Drain-Source On Resistance:

2.7 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

12 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP4NK50ZD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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