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STP270N04

STMicroelectronics

STP270N04 by STMicroelectronics

STP270N04 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 120 A, a breakdown voltage of 40 V, and operates at up to 175 °C. Ideal for high-power circuits with low on-resistance (0.0029 Ω).

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 5,177 parts In-Stock

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Anansix

USA . 1,412 parts In-Stock

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Digiode

USA . 776 parts In-Stock

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IDEA Electronic Components Group

UK . 977 parts In-Stock

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$0.871

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$0.784

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977

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MKK Technologies

India . 720 parts In-Stock

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$1.638

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720

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DigiPath Technology Company

USA . 720 parts In-Stock

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$1.638

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720

$1.638

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AZTECH Wire

Italy . 63 parts In-Stock

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$16.770

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63

$16.770

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Alle Elektronik GmbH

Germany . 4,907 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,725 parts In-Stock

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Corphita

USA . 4,573 parts In-Stock

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Parana Technologies

USA . 1,322 parts In-Stock

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$1.042

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Kepictronics

USA . 1,000 parts In-Stock

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Overview

Elevate your designs with the STP270N04 from STMicroelectronics, a powerhouse in Power FET technology. Renowned for its exceptional quality and reliability, STMicroelectronics delivers unmatched performance with this N-channel transistor, ideal for high-efficiency switching applications. Experience unparalleled benefits such as robust thermal management and high current handling, ensuring seamless operation in demanding environments. Trust in STMicroelectronics to power your innovations forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides durability and protection from environmental factors, making it suitable for a range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher efficiency and better performance for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode improves circuit efficiency by allowing for easier management of reverse current.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control power with low losses.

Minimum DS Breakdown Voltage: 40 V

A minimum breakdown voltage of 40 V ensures reliable operation in various voltage conditions.

Package Shape: RECTANGULAR

The rectangular shape optimizes space in circuit designs, allowing for easier integration.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and reliable electrical connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control over current flow and reduces power consumption.

Maximum Pulsed Drain Current (IDM): 480 A

The high pulsed drain current capability makes this FET ideal for applications requiring high power handling.

Avalanche Energy Rating (EAS): 1000 mJ

A high avalanche energy rating provides resilience against transient voltage spikes, enhancing reliability.

Maximum Drain Current (Abs) (ID): 120 A

Capable of handling up to 120 A of drain current, making it suitable for high-power applications.

No. of Terminals: 3

Three terminals simplify the connection while providing necessary functionalities for circuit designs.

Maximum Power Dissipation (Abs): 330 W

330 W power dissipation capability allows for operation in high-power applications without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mounting provides secure fitting to circuits, improving stability and reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high efficiency and fast switching, making it ideal for modern electronics.

Maximum Operating Temperature: 175 °C

A high operating temperature tolerance ensures reliability in demanding environments.

Transistor Element Material: SILICON

Silicon material allows for good thermal stability and effective conduction in transistor operations.

Terminal Finish: Matte Tin (Sn)

Matte tin terminal finish improves solderability and corrosion resistance for a longer lifespan.

Maximum Drain Current (ID): 120 A

Reiterating the ability to support up to 120 A emphasizes the versatility in power management tasks.

Maximum Drain-Source On Resistance: 0.0029 ohm

Low on-resistance minimizes heat generation and maximizes efficiency in power conversion applications.

Terminal Position: SINGLE

Single terminal position allows for straightforward layout in circuit designs, simplifying assembly.

Case Connection: DRAIN

DRAIN case connection design enhances the ease of implementation in power circuits.

Technical Specifications

Power Field Effect Transistors (FET) STP270N04 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1000 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0029 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

480 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP270N04 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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