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STP270N4F3

STMicroelectronics

STP270N4F3 by STMicroelectronics

STP270N4F3 by STMicroelectronics is a N-CHANNEL FET with 40V DS Breakdown Voltage, 480A IDM, and 0.0029 ohm RDS. It's used for SWITCHING applications due to its 175°C max temp, 1000 mJ EAS rating, and SINGLE configuration with BUILT-IN DIODE.

Median Price

$2.493

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$2.493

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50

$2.493

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Vyrian

USA . 4,372 parts In-Stock

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4,372

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Digiode

USA . 1,320 parts In-Stock

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1,320

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Anansix

USA . 345 parts In-Stock

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345

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Microfarads

USA . 96 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 5 parts In-Stock

1+ parts

$1.704

100+ parts

-

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$1.533

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5

$1.704

-

$1.533

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Continental Prestige Electronics

USA . 5,061 parts In-Stock

1+ parts

$2.493

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$2.443

5,061

$2.493

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$2.443

Argo Parts USA

USA . 711 parts In-Stock

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$2.493

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711

$2.493

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Netroflash

USA . 500 parts In-Stock

1+ parts

$2.493

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$2.368

10k+ parts

$2.318

500

$2.493

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$2.368

$2.318

MKK Technologies

India . 528 parts In-Stock

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$3.204

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DigiPath Technology Company

USA . 528 parts In-Stock

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$3.204

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$3.204

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AZTECH Wire

Italy . 783 parts In-Stock

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$15.786

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Ampacity Inc.

Singapore . 859 parts In-Stock

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$58.050

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Lixinc

USA . 7,932 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,767 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,866 parts In-Stock

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Corphita

USA . 2,541 parts In-Stock

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Parana Technologies

USA . 351 parts In-Stock

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$2.037

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351

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$2.037

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Experience top-of-the-line power management with the STP270N4F3 by STMicroelectronics. As a leading manufacturer in the industry, this N-CHANNEL Power FET offers unmatched reliability and efficiency for various switching applications. With a high DS breakdown voltage of 40V and an incredible pulsing drain current of 480A, this transistor is designed to handle demanding tasks with ease. Say goodbye to overheating issues thanks to its maximum power dissipation of 330W. Upgrade your projects with the STP270N4F3 and enjoy the peace of mind that comes with superior performance and quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and efficiency compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect the circuit from reverse voltage spikes, increasing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing fast and efficient operation.

Minimum DS Breakdown Voltage: 40 V

Can handle higher voltages, making it suitable for a variety of power applications.

Maximum Pulsed Drain Current (IDM): 480 A

Capable of handling high current loads, ideal for power applications that require a sudden surge of current.

Avalanche Energy Rating (EAS): 1000 mJ

High avalanche energy rating ensures reliable operation during transient conditions.

Maximum Power Dissipation (Abs): 330 W

Can dissipate heat effectively, allowing for continuous operation at high power levels.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low power consumption.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without failure, suitable for demanding environments.

Maximum Drain-Source On Resistance: 0.0029 ohm

Low on-resistance results in minimal power loss and efficient operation.

Technical Specifications

Power Field Effect Transistors (FET) STP270N4F3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1000 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0029 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

480 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP270N4F3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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