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STP10NM65N

STMicroelectronics

STP10NM65N by STMicroelectronics

STP10NM65N by STMicroelectronics is a powerful N-channel MOSFET designed for efficient switching applications. It features a 650V breakdown voltage, 36A pulsed drain current, and operates at up to 150 °C. Ideal for high-performance power management in various electronic devices.

Median Price

$1.408

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,000 parts In-Stock

1+ parts

$1.408

100+ parts

$1.408

1k+ parts

$1.408

10k+ parts

$1.408

1,000

$1.408

$1.408

$1.408

$1.408

Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

$2.420

100+ parts

-

1k+ parts

-

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-

1,000

$2.420

-

-

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Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$1.408

1k+ parts

$1.408

10k+ parts

$1.408

1,000

-

$1.408

$1.408

$1.408

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,945 parts In-Stock

1+ parts

$1.338

100+ parts

-

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2,945

$1.338

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Vyrian

USA . 7,891 parts In-Stock

1+ parts

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7,891

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Anansix

USA . 2,538 parts In-Stock

1+ parts

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2,538

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ACDS - Activité Composants Distribution Service

France . 849 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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849

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Bristol Electronics

USA . 849 parts In-Stock

1+ parts

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849

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Dan-Mar Components

USA . 849 parts In-Stock

1+ parts

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849

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 11 parts In-Stock

1+ parts

$0.280

100+ parts

-

1k+ parts

$0.252

10k+ parts

-

11

$0.280

-

$0.252

-

MKK Technologies

India . 2,218 parts In-Stock

1+ parts

$0.526

100+ parts

-

1k+ parts

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10k+ parts

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2,218

$0.526

-

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DigiPath Technology Company

USA . 2,218 parts In-Stock

1+ parts

$0.526

100+ parts

-

1k+ parts

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10k+ parts

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2,218

$0.526

-

-

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Corphita

USA . 3,219 parts In-Stock

1+ parts

$1.267

100+ parts

-

1k+ parts

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3,219

$1.267

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Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$1.521

100+ parts

$1.384

1k+ parts

$1.247

10k+ parts

-

270

$1.521

$1.384

$1.247

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Component Stockers USA

USA . 6,551 parts In-Stock

1+ parts

$1.600

100+ parts

$1.600

1k+ parts

$1.600

10k+ parts

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6,551

$1.600

$1.600

$1.600

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AZTECH Wire

Italy . 391 parts In-Stock

1+ parts

$8.460

100+ parts

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391

$8.460

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Kepictronics

USA . 8,230 parts In-Stock

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8,230

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

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8,000

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Alle Elektronik GmbH

Germany . 4,437 parts In-Stock

1+ parts

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4,437

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Perfect Parts

USA . 1,894 parts In-Stock

1+ parts

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1,894

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Parana Technologies

USA . 1,280 parts In-Stock

1+ parts

-

100+ parts

$0.334

1k+ parts

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10k+ parts

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1,280

-

$0.334

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Overview

Unlock unparalleled performance with the STP10NM65N from STMicroelectronics, a trusted leader in semiconductor solutions. This robust N-channel power FET is designed for high-efficiency switching applications, ensuring reliability and longevity in your projects. With superior quality and advanced technology, it delivers exceptional power management and thermal stability, making it ideal for industrial automation, renewable energy systems, and more. Choose STMicroelectronics for unmatched innovation and value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, this material offers excellent protection against environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher efficiency and better performance in switching applications compared to their P-channel counterparts.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode enhances the device's performance by protecting against back EMF and allows for faster switching.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring robust performance in controlling power across various electronic devices.

Minimum DS Breakdown Voltage: 650 V

The high breakdown voltage allows the transistor to safely operate in high-voltage environments, making it versatile for different applications.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient layout and design in PCB, facilitating compact assemblies.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides excellent mechanical stability and enhanced thermal dissipation, making it reliable for heavy-duty applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures minimal leakage current in the off state, improving overall efficiency.

Maximum Pulsed Drain Current (IDM): 36 A

A high pulsed drain current rating makes this FET suitable for applications demanding high transient capabilities.

Avalanche Energy Rating (EAS): 300 mJ

A robust EAS rating enables the transistor to withstand energy spikes, providing enhanced reliability in demanding operations.

Maximum Drain Current (Abs) (ID): 9 A

The ability to handle up to 9 A of drain current makes the FET suitable for various switching applications without overheating.

No. of Terminals: 3

With only three terminals, the FET offers simplicity in design and easy integration into electronic circuits.

Maximum Power Dissipation (Abs): 90 W

A high power dissipation capacity ensures that the FET can operate effectively in high-power applications without thermal throttling.

Package Style (Meter): FLANGE MOUNT

Flange mount design facilitates easy mounting and provides increased surface area for better heat dissipation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology allows for fast switching and high efficiency, making it suitable for a variety of electronic devices.

Maximum Operating Temperature: 150 °C

Designed to function at high temperatures, this FET is reliable in harsh environments, ensuring consistent performance.

Transistor Element Material: SILICON

Silicon is well-known for its excellent electrical properties, making this FET suitable for a range of power applications.

Terminal Finish: MATTE TIN

The matte tin finish improves solderability and ensures lasting connections, which enhances the reliability of the product.

Maximum Drain Current (ID): 9 A

This specification confirms the transistor's ability to handle significant current, making it ideal for demanding applications.

Maximum Drain-Source On Resistance: 0.48 ohm

Low on-resistance ensures efficient operation with minimal power loss during conduction, enhancing the overall performance of the FET.

Terminal Position: SINGLE

A single terminal position contributes to straightforward circuit designs and easier assembly in electronic applications.

Technical Specifications

Power Field Effect Transistors (FET) STP10NM65N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

300 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

9 A

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.48 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

36 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP10NM65N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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