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STM32MP133DAF7

STMicroelectronics

STM32MP133DAF7 by STMicroelectronics

STM32MP133DAF7 by STMicroelectronics is a 32-bit RISC microprocessor with a max clock frequency of 48 MHz and integrated cache. It operates b/w -40 °C to 105 °C, making it ideal for industrial applications. With low power modes and extensive I/O options, it's perfect for embedded systems.

Median Price

$6.435

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 200 parts In-Stock

1+ parts

$8.010

100+ parts

$4.860

1k+ parts

$4.270

10k+ parts

$3.570

200

$8.010

$4.860

$4.270

$3.570

Verical

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$4.860

1k+ parts

$4.580

10k+ parts

-

200

-

$4.860

$4.580

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 652 parts In-Stock

1+ parts

$7.458

100+ parts

-

1k+ parts

-

10k+ parts

-

652

$7.458

-

-

-

Vyrian

USA . 5,408 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,408

-

-

-

-

Anansix

USA . 1,961 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,961

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,371 parts In-Stock

1+ parts

$7.065

100+ parts

-

1k+ parts

-

10k+ parts

-

4,371

$7.065

-

-

-

AZTECH Wire

Italy . 213 parts In-Stock

1+ parts

$9.610

100+ parts

-

1k+ parts

-

10k+ parts

-

213

$9.610

-

-

-

GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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50

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Overview

Elevate your innovation with the STM32MP133DAF7 from STMicroelectronics—a powerhouse microprocessor designed for exceptional performance in diverse applications. Renowned for their unwavering quality, STMicroelectronics offers you reliability and cutting-edge technology that seamlessly integrates into your projects. This efficient, low-power solution is perfect for industrial control, IoT devices, and smart home applications, empowering you to create smarter, more connected solutions while maximizing efficiency and longevity. Experience unmatched value and performance with STM32MP133DAF7—where your vision meets our expertise!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making it suitable for a variety of operating conditions.

Integrated Cache: YES

An integrated cache improves processing speed and efficiency by reducing the time taken to access frequently used data.

Surface Mount: YES

Surface mount technology allows for a compact design, facilitating high-density circuit layouts and lower manufacturing costs.

Maximum Supply Voltage: 1.38 V

This voltage specification ensures compatibility with low-power applications, optimizing energy efficiency.

On Chip Data RAM Width: 8

An 8-bit data RAM width allows for efficient data manipulation and storage for applications requiring moderate memory bandwidth.

Address Bus Width: 26

A 26-bit address bus can address a larger memory space, enhancing performance for applications with higher memory demands.

Package Shape: SQUARE

The square package shape optimizes space usage on PCBs, making it flexible for various design applications.

Bit Size: 32

A 32-bit architecture enables better performance and processing power, allowing for running more advanced applications.

No. of Terminals: 320

A high number of terminals supports extensive connectivity options, allowing for versatile integration in different systems.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style supports modern manufacturing techniques and allows for compact designs in space-constrained environments.

Minimum Supply Voltage: 1.32 V

Lower minimum voltage allows for better performance in battery-powered devices, enhancing energy efficiency.

Maximum Operating Temperature: 105 °C

A high maximum operating temperature indicates reliability in harsh environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

This low temperature capability allows the microprocessor to function in extremely cold environments, increasing its versatility.

Terminal Position: BOTTOM

Bottom terminal positioning allows for lower profile designs and can improve thermal performance.

Maximum Seated Height: 1.2 mm

A low seated height is ideal for compact designs, enabling use in space-constrained applications.

RAM Words: 172032

A significant count of RAM words enhances processing capabilities, making it suitable for data-intensive tasks.

Width: 11 mm

A narrow width can be advantageous in devices where space is limited, supporting miniaturization.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging, enhancing reliability during development and production.

External Data Bus Width: 16

A 16-bit external data bus facilitates considerable data transfer rates, which is useful for high-speed applications.

Maximum Clock Frequency: 48 MHz

With a maximum clock frequency of 48 MHz, this microprocessor can handle moderate computational loads effectively.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor means it benefits from a simplified instruction set, promoting better performance per watt.

Technology: CMOS

CMOS technology results in lower power consumption and better performance, making it suitable for battery-operated devices.

Terminal Form: BALL

Ball terminal form improves solderability and enables better thermal performance, ensuring a reliable connection.

Maximum Supply Current: 268 mA

A maximum supply current of 268 mA indicates the microprocessor can handle significant workloads, suitable for demanding applications.

Nominal Supply Voltage: 1.35 V

The nominal supply voltage caters to lower power requirements, highlighting its efficiency in power-sensitive applications.

No. of DMA Channels: 56

A high number of DMA channels allows advanced data handling and transfer capabilities without CPU intervention.

No. of Serial I/Os: 10

With 10 serial I/O channels, this microprocessor enhances connectivity options for various peripheral devices.

Terminal Pitch: 0.5 mm

0.5 mm terminal pitch permits tighter packing of components, which is advantageous in space-limited designs.

Format: FIXED POINT

The fixed-point format supports efficient processing and is especially useful for applications in embedded systems.

Speed: 1000 rpm

A speed rating of 1000 rpm indicates suitable operational speed for certain applications, enhancing overall performance.

Low Power Mode: YES

The low power mode feature allows for energy savings and extends battery life in portable devices.

Technical Specifications

Microprocessors STM32MP133DAF7 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B320

Length:

11 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

10

No. of Terminals:

320

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA320,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.2 mm

Speed:

1000 rpm

Maximum Supply Current:

268 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.32 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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