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STM32MP133CAG3

STMicroelectronics

STM32MP133CAG3 by STMicroelectronics

STM32MP133CAG3 by STMicroelectronics is a 32-bit RISC microprocessor with a max clock frequency of 48 MHz and operates b/w -40 °C to 125 °C. It features integrated cache, supports up to 56 DMA channels, and is ideal for low-power applications. Its compact design makes it suitable for various embedded systems.

Median Price

-

Lifecycle Status

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4

In-Stock Inventory

1k+

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Avnet

USA . 1,040 parts In-Stock

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Vyrian

USA . 8,276 parts In-Stock

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8,276

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Anansix

USA . 1,240 parts In-Stock

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Digiode

USA . 718 parts In-Stock

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718

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AZTECH Wire

Italy . 739 parts In-Stock

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$9.820

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739

$9.820

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Corphita

USA . 3,839 parts In-Stock

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Overview

Unlock unparalleled performance and efficiency with the STM32MP133CAG3 from STMicroelectronics. Renowned for exceptional quality and innovation, STMicroelectronics empowers your projects with a microprocessor designed for robust applications in industrial automation, smart homes, and IoT devices. Experience the benefits of low power consumption, advanced processing capabilities, and seamless integration, ensuring your solutions are not just functional, but also future-ready. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures a robust package that can withstand various environmental stresses, making it suitable for reliable performance in multiple applications.

Integrated Cache: YES

The presence of an integrated cache allows for faster data access and improved overall processing performance, which is essential for high-performance applications.

Surface Mount: YES

Surface mount technology facilitates compact design and automated assembly, enhancing manufacturing efficiency and saving valuable space on the PCB.

Maximum Supply Voltage: 1.38 V

With a maximum supply voltage of 1.38 V, this microprocessor operates within a low voltage range, contributing to energy efficiency and prolonged battery life in portable devices.

On Chip Data RAM Width: 8

An 8-bit on-chip data RAM width supports efficient data handling and processing capabilities, allowing for smooth operation in data-intensive applications.

Address Bus Width: 26

A 26-bit address bus width enhances the addressing capability, enabling support for a larger memory space, which is beneficial for complex applications.

Package Shape: SQUARE

The square package shape simplifies layout design and integration into various system configurations, improving adaptability in diverse applications.

Bit Size: 32

A 32-bit architecture supports advanced computational tasks, making this microprocessor suitable for modern applications that require efficient processing of larger data types.

No. of Terminals: 289

With 289 terminals, this microprocessor accommodates extensive connectivity options for peripherals and interfaces, enhancing its versatility in different use cases.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array package style allows for efficient heat dissipation and high-density mounting, ideal for applications where space is at a premium.

Minimum Supply Voltage: 1.21 V

Operating at a minimum supply voltage of 1.21 V further improves power efficiency, making this microprocessor an excellent choice for low-power applications.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C indicates robust thermal management and stability in high-temperature environments, extending the microprocessor's application range.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microprocessor is suitable for use in harsh conditions, enhancing reliability in outdoor or extreme environments.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies PCB design and aids in better connectivity reliability, which is crucial for high-density applications.

Maximum Seated Height: 1.2 mm

A low seated height of 1.2 mm allows for miniaturization and slim profile designs, making it an ideal choice for compact electronic devices.

RAM Words: 172032

The capability of addressing 172032 RAM words ensures sufficient on-chip memory for data processing, vital for applications needing significant computational resources.

Width: 9 mm

A small width of 9 mm contributes to the overall compactness of PCB design, making it suitable for space-constrained applications.

Boundary Scan: YES

Support for boundary scan technology enables easier testing and debugging, improving the overall reliability and manufacturability of electronic systems.

External Data Bus Width: 16

A 16-bit external data bus width allows for efficient communication with other components, improving data transfer rates and overall system performance.

Maximum Clock Frequency: 48 MHz

Operating at a maximum clock frequency of 48 MHz provides sufficient processing speed for a wide range of applications, from embedded systems to automotive controls.

Peripheral IC Type: MICROPROCESSOR, RISC

As a RISC microprocessor, it benefits from a simplified instruction set, leading to faster execution, reduced power consumption, and efficient performance.

Technology: CMOS

CMOS technology supports low power consumption and high noise immunity, making this microprocessor ideal for battery-operated and portable devices.

Terminal Form: BALL

Ball terminal design provides reliable solder joints and allows for better thermal conductivity, ensuring efficient heat dissipation during operation.

Maximum Supply Current: 239 mA

With a maximum supply current of 239 mA, this microprocessor strikes a balance between performance and energy efficiency, suitable for a variety of applications.

Nominal Supply Voltage: 1.25 V

A nominal supply voltage of 1.25 V indicates optimal power consumption, making it suitable for energy-sensitive applications and ensuring lower operational costs.

No. of DMA Channels: 56

The presence of 56 DMA channels facilitates efficient data transfers without CPU intervention, optimizing system performance and throughput.

No. of Serial I/Os: 10

Having 10 serial I/O ports allows for versatile connectivity options with various devices and peripherals, enhancing the microprocessor's usability in different scenarios.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for closer spacing of connections, making it suitable for modern high-density circuit board designs.

Format: FIXED POINT

The fixed-point format supports certain mathematical operations more efficiently, making it beneficial for applications such as digital signal processing.

Speed: 650 rpm

A speed of 650 rpm ensures reliable performance for various real-time applications, helping to meet the demands of high-speed data processing.

Low Power Mode: YES

The availability of a low power mode allows this microprocessor to conserve energy when full power is not needed, making it ideal for battery-operated devices and extending operational life.

Technical Specifications

Microprocessors STM32MP133CAG3 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B289

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

10

No. of Terminals:

289

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.2 mm

Speed:

650 rpm

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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