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STM32MP133CAE3

STMicroelectronics

STM32MP133CAE3 by STMicroelectronics

STM32MP133CAE3 by STMicroelectronics is a 32-bit RISC microprocessor with a max clock frequency of 48 MHz and integrated cache. It operates b/w -40 °C to 125 °C, making it ideal for industrial applications. With low power modes and extensive I/O options, it's perfect for embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Avnet

USA . 476 parts In-Stock

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Vyrian

USA . 7,490 parts In-Stock

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Digiode

USA . 3,506 parts In-Stock

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Anansix

USA . 610 parts In-Stock

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610

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AZTECH Wire

Italy . 935 parts In-Stock

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935

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Corphita

USA . 4,735 parts In-Stock

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Overview

Unlock the power of innovation with the STM32MP133CAE3 microprocessor from STMicroelectronics, a leader in quality and reliability. Designed for diverse applications ranging from industrial automation to smart home devices, this low-power powerhouse ensures optimal performance in demanding environments. Experience the perfect blend of efficiency and versatility, enabling your projects to thrive while reducing costs and enhancing productivity. Elevate your designs with trusted excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of high-quality plastic/epoxy material enhances durability and thermal resistance, making it suitable for various applications.

Integrated Cache: YES

Having an integrated cache improves processing speed and efficiency, enabling faster data access and higher overall performance.

Surface Mount: YES

Surface mount technology allows for smaller packaging and efficient use of board space, making it ideal for compact electronic designs.

Maximum Supply Voltage: 1.38 V

A lower maximum supply voltage ensures lower energy consumption, contributing to energy-efficient designs and extending battery life in portable applications.

On Chip Data RAM Width: 8

An 8-bit data RAM width allows for efficient data manipulation and is suitable for a range of applications requiring moderate processing power.

Address Bus Width: 26

A wide address bus width of 26 bits supports a larger memory address range, enabling the use of more extensive data sets and efficient memory access.

Package Shape: SQUARE

The square package shape facilitates better heat dissipation and placement on PCBs, aiding in reliable performance.

Bit Size: 32

A 32-bit architecture provides a good balance between performance and complexity, making it suitable for varied applications from embedded to general-purpose processing.

No. of Terminals: 289

A high number of terminals supports a wide range of interfacing capabilities, allowing for diverse connectivity options in complex systems.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style allows for high-density connections while maintaining a low profile, essential for modern compact designs.

Minimum Supply Voltage: 1.21 V

A minimum supply voltage of 1.21V stresses the energy-efficient design, which is ideal for battery-operated applications.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures stability and reliability in demanding environments.

Minimum Operating Temperature: -40 °C

Operating at temperatures as low as -40 °C makes this processor suitable for extreme environments, enhancing versatility.

Terminal Position: BOTTOM

Bottom terminal positioning makes for easier installation on PCBs and promotes better heat management.

Maximum Seated Height: 1.7 mm

A low seated height contributes to compact device designs, accommodating space-constrained applications.

RAM Words: 172032

A significant number of RAM words allows for efficient data processing and enhances the ability to handle larger applications.

Width: 14 mm

A compact width of 14 mm enables versatile design options in space-constrained applications.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging, ensuring higher reliability and easier maintenance of the system.

External Data Bus Width: 16

A 16-bit external data bus width allows for efficient communication with other components, enhancing system performance.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz provides sufficient speed for many applications, balancing power consumption and performance.

Length: 14 mm

The length of 14 mm complements its width for an overall compact package, suitable for modern electronic designs.

Peripheral IC Type: MICROPROCESSOR, RISC

As a RISC microprocessor, it offers efficient instruction execution, providing better performance per watt for various applications.

Technology: CMOS

CMOS technology contributes to low power consumption and high-speed operation, which is essential for energy-efficient designs.

Terminal Form: BALL

Ball terminal form allows for a reliable electronic connection and supports modern packaging techniques for high-density layouts.

Maximum Supply Current: 239 mA

A maximum supply current of 239 mA makes it suitable for a wide range of applications while ensuring that power requirements remain manageable.

Nominal Supply Voltage: 1.25 V

This nominal supply voltage ensures optimal performance while minimizing power consumption, which is crucial for efficient designs.

No. of DMA Channels: 56

Having 56 DMA channels allows for efficient data transfers without CPU intervention, enhancing overall system performance.

No. of Serial I/Os: 10

Ten serial I/O channels provide versatile connectivity options for various peripherals, making it suitable for complex systems.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for finer connections, aiding in the development of compact, high-density electronic assemblies.

Format: FIXED POINT

Fixed-point format allows for efficient arithmetic operations in specific applications, optimizing performance and resource usage.

Speed: 650 rpm

A speed of 650 rpm indicates efficient processing capabilities, suitable for applications in embedded systems requiring quick response.

Low Power Mode: YES

Low power mode enhances energy efficiency, making it particularly useful for battery-operated and portable devices, ensuring longer operational life.

Technical Specifications

Microprocessors STM32MP133CAE3 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B289

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

10

No. of Terminals:

289

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.7 mm

Speed:

650 rpm

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

14 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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