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STM32MP133AAG3

STMicroelectronics

STM32MP133AAG3 by STMicroelectronics

STM32MP133AAG3 by STMicroelectronics is a 32-bit RISC microprocessor with a max clock frequency of 48 MHz, supporting low power modes. It features integrated cache and operates b/w -40 °C to 125 °C. Ideal for embedded applications requiring efficient processing in compact designs.

Median Price

$7.730

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 145 parts In-Stock

1+ parts

$7.730

100+ parts

$5.050

1k+ parts

$4.520

10k+ parts

-

145

$7.730

$5.050

$4.520

-

DigiKey

USA . 100 parts In-Stock

1+ parts

$7.730

100+ parts

$5.049

1k+ parts

$4.566

10k+ parts

-

100

$7.730

$5.049

$4.566

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,510 parts In-Stock

1+ parts

$7.125

100+ parts

-

1k+ parts

-

10k+ parts

-

2,510

$7.125

-

-

-

Vyrian

USA . 6,818 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,818

-

-

-

-

Anansix

USA . 226 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

226

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,183 parts In-Stock

1+ parts

$6.750

100+ parts

-

1k+ parts

-

10k+ parts

-

1,183

$6.750

-

-

-

Overview

Unlock the future of innovation with the STM32MP133AAG3 microprocessor from STMicroelectronics. Renowned for its superior quality and reliability, this power-packed solution excels in diverse applications—from industrial automation to IoT devices. Experience unparalleled efficiency and robust performance, all while benefiting from STMicroelectronics' decades of expertise. Elevate your projects with a component that combines cutting-edge technology with exceptional value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection, ensuring longer product lifespan and reliability.

Integrated Cache: YES

Having an integrated cache improves processing speed by reducing access time for frequently used data.

Surface Mount: YES

Surface mount technology allows for higher density mounting and smaller device footprints, making it suitable for compact designs.

Maximum Supply Voltage: 1.38 V

The low maximum supply voltage enhances power efficiency, making it ideal for battery-operated devices.

On Chip Data RAM Width: 8

An 8-bit data RAM width allows efficient handling of data, suitable for various applications requiring moderate data processing.

Address Bus Width: 26

A 26-bit address bus width enables the processor to address a larger memory space, increasing overall system capacity.

Package Shape: SQUARE

The square package shape is efficient for space utilization on printed circuit boards (PCBs), simplifying layout design.

Bit Size: 32

A 32-bit architecture can process larger data types and supports more complex applications, enhancing performance.

No. of Terminals: 289

A higher number of terminals allows for more connections, enabling better integration with peripherals and more advanced features.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This packaging style ensures a compact design while facilitating effective thermal management and electrical performance.

Minimum Supply Voltage: 1.21 V

The low minimum supply voltage further contributes to energy efficiency, making it environmentally friendly.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature provides reliability in extreme environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Ability to function in low temperatures makes it versatile for a wide range of applications, including harsh climates.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient thermal dissipation, contributing to device longevity.

Maximum Seated Height: 1.2 mm

A low seated height is beneficial for ultra-thin devices, making it a good choice for compact designs.

RAM Words: 172032

A significant RAM word count allows for better multitasking and complex computations, suitable for sophisticated applications.

Width: 9 mm

The compact width is advantageous for space-constrained applications, facilitating integration into smaller devices.

Boundary Scan: YES

Boundary scan capability supports easier testing and debugging of circuitry, improving production efficiency.

External Data Bus Width: 16

A 16-bit external data bus width enhances data transfer rates with connected devices, improving overall system performance.

Maximum Clock Frequency: 48 MHz

The 48 MHz clock frequency provides sufficient processing power for a range of applications, balancing performance and power consumption.

Length: 9 mm

The 9 mm length is suitable for compact designs, making it ideal for small electronic devices.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture optimizes performance and efficiency, allowing faster instruction execution for demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making it energy-efficient for modern applications.

Terminal Form: BALL

A ball terminal form enhances soldering quality and reliability, ensuring stable connections on the PCB.

Maximum Supply Current: 239 mA

The relatively low maximum supply current contributes to energy efficiency, reducing heat generation and power use.

Nominal Supply Voltage: 1.25 V

The nominal supply voltage ensures compatibility with low-power applications, making it suitable for portable devices.

No. of DMA Channels: 56

A high number of DMA channels allows for efficient data transfer without CPU intervention, improving overall system performance.

No. of Serial I/Os: 10

Having multiple serial I/O channels enables better communication options with external devices, enhancing connectivity.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for more pins in a smaller area, improving the integration of complex circuits.

Format: FIXED POINT

The fixed point format is suitable for applications requiring high precision in calculations, like signal processing.

Speed: 650 rpm

The operational speed of 650 rpm is suitable for controlling devices requiring consistent and responsive performance.

Low Power Mode: YES

Support for low power mode increases battery life in portable applications, making it energy-efficient and user-friendly.

Technical Specifications

Microprocessors STM32MP133AAG3 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B289

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

10

No. of Terminals:

289

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.2 mm

Speed:

650 rpm

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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