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STM32MP131DAF7

STMicroelectronics

STM32MP131DAF7 by STMicroelectronics

STM32MP131DAF7 by STMicroelectronics is a 32-bit RISC microprocessor with a max clock frequency of 48 MHz, operating voltage b/w 1.32-1.38 V, and integrated cache. It features 320 terminals and supports low power modes, ideal for embedded applications in harsh environments. Its compact design ensures efficient performance in space-constrained devices.

Median Price

$5.700

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 200 parts In-Stock

1+ parts

$6.970

100+ parts

$4.230

1k+ parts

$3.720

10k+ parts

$3.260

200

$6.970

$4.230

$3.720

$3.260

Verical

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$4.430

1k+ parts

$4.180

10k+ parts

-

200

-

$4.430

$4.180

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,529 parts In-Stock

1+ parts

$6.792

100+ parts

-

1k+ parts

-

10k+ parts

-

3,529

$6.792

-

-

-

Vyrian

USA . 4,529 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,529

-

-

-

-

Anansix

USA . 1,951 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,951

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,206 parts In-Stock

1+ parts

$6.435

100+ parts

-

1k+ parts

-

10k+ parts

-

4,206

$6.435

-

-

-

AZTECH Wire

Italy . 790 parts In-Stock

1+ parts

$20.570

100+ parts

-

1k+ parts

-

10k+ parts

-

790

$20.570

-

-

-

Overview

Unlock unparalleled performance with the STM32MP131DAF7 from STMicroelectronics, a name synonymous with innovation and reliability. This microprocessor excels in diverse applications, from industrial automation to smart home solutions, offering low power consumption without compromising speed. Its robust design ensures operational stability in extreme conditions, making it the ideal choice for your next project. Experience quality and efficiency that elevate your designs to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides durability and resistance to environmental factors, making the microprocessor reliable for various applications.

Integrated Cache: YES

Having an integrated cache enhances the processing speed by reducing the access time for frequently used data.

Surface Mount: YES

Surface mount technology allows for smaller board space and improved electrical performance, making it suitable for compact designs.

Maximum Supply Voltage: 1.38 V

The low maximum supply voltage helps in reducing power consumption, contributing to energy-efficient designs.

On Chip Data RAM Width: 8

An 8-bit on-chip data RAM width allows for efficient data processing, supporting various processing operations.

Address Bus Width: 26

A 26-bit address bus width permits direct addressing of larger memory ranges, enhancing system flexibility.

Package Shape: SQUARE

The square package shape aids in balanced heat distribution, contributing to stable performance during operation.

Bit Size: 32

A 32-bit bit size ensures that the microprocessor can handle large amounts of data and perform complex calculations efficiently.

No. of Terminals: 320

The high number of terminals allows for greater connectivity options and integration capabilities in embedded systems.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style supports high-density designs and improves thermal performance, making it suitable for modern applications.

Minimum Supply Voltage: 1.32 V

A low minimum supply voltage supports power efficiency, making it ideal for battery-operated devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliability and performance in demanding environments.

Minimum Operating Temperature: -40 °C

A wide operating temperature range makes this microprocessor suitable for various industrial and automotive applications.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates compact layout and improved thermal management.

Maximum Seated Height: 1.2 mm

A low seated height enables a slim profile for devices, ideal for portable and compact applications.

RAM Words: 172032

Having a significant number of RAM words allows for effective data handling and multitasking capabilities.

Width: 11 mm

A compact width is advantageous for space-constrained designs, enabling more components to fit in smaller PCBs.

Boundary Scan: YES

Boundary scan capability enhances testing and debugging processes in complex electronic systems.

External Data Bus Width: 16

A 16-bit external data bus width allows for efficient communication with external devices and components.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz provides adequate processing power for many applications while maintaining low power consumption.

Length: 11 mm

A 11 mm length complements the compact design goals, allowing integration into smaller devices.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor indicates a design that emphasizes efficiency and speed in instruction execution.

Technology: CMOS

CMOS technology supports low static power consumption, which is essential for battery-operated and portable devices.

Terminal Form: BALL

Ball terminal form enhances solderability and mechanical stability, ensuring robust device assembly.

Maximum Supply Current: 268 mA

A maximum supply current of 268 mA ensures sufficient power for high-performance tasks while remaining energy efficient.

Nominal Supply Voltage: 1.35 V

The nominal supply voltage further emphasizes energy efficiency, making it a solid choice for low-power applications.

No. of DMA Channels: 56

A high number of DMA channels facilitates efficient data transfer without CPU intervention, improving overall system performance.

No. of Serial I/Os: 8

Having 8 serial I/O channels offers flexibility in interfacing with multiple serial devices.

Terminal Pitch: 0.5 mm

A fine terminal pitch enables high-density designs, which are essential for modern electronics.

Format: FIXED POINT

The fixed-point format is suitable for applications that require efficient arithmetic operations without floating-point overhead.

Speed: 1000 rpm

A speed rating of 1000 rpm indicates its capability in real-time processing tasks, providing responsiveness in applications.

Low Power Mode: YES

The availability of a low power mode extends battery life in portable applications, making it an excellent choice for mobile devices.

Technical Specifications

Microprocessors STM32MP131DAF7 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B320

Length:

11 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

8

No. of Terminals:

320

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA320,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.2 mm

Speed:

1000 rpm

Maximum Supply Current:

268 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.32 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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