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STL70N2LLH5

STMicroelectronics

STL70N2LLH5 by STMicroelectronics

STL70N2LLH5 by STMicroelectronics is a N-CHANNEL FET with 30V DS Breakdown Voltage and 72A IDM. Ideal for SWITCHING applications, it features 0.0085 ohm Drain-Source On Resistance and operates in ENHANCEMENT MODE. The PLASTIC/EPOXY package with NO LEAD terminals is designed for surface mount installation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,593 parts In-Stock

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Digiode

USA . 3,352 parts In-Stock

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Anansix

USA . 492 parts In-Stock

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492

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 476 parts In-Stock

1+ parts

$1.138

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$1.024

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476

$1.138

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MKK Technologies

India . 3 parts In-Stock

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$2.140

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$2.140

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DigiPath Technology Company

USA . 3 parts In-Stock

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$2.140

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$2.140

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Corphita

USA . 3,378 parts In-Stock

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Parana Technologies

USA . 1,316 parts In-Stock

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$1.361

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$1.361

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Overview

Upgrade your power control systems with the STL70N2LLH5 from STMicroelectronics. Crafted with precision using cutting-edge technology, this N-CHANNEL Power FET offers unrivaled performance and reliability in switching applications. With a maximum drain current of 18A and a low on-resistance, this transistor provides efficient power management solutions. Whether you're looking to enhance the efficiency of your automotive, industrial or consumer electronics, the STL70N2LLH5 is the perfect choice. Trust STMicroelectronics to deliver superior quality and innovation for all your power transistor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers good insulation and protection for the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher electron mobility, making them highly efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier and more efficient circuit design, reducing the need for additional components.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in these scenarios.

Surface Mount: YES

Surface mount design makes for easy and efficient PCB assembly.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltages without breakdown.

Package Shape: RECTANGULAR

Rectangular shape allows for compact and efficient PCB layout and design.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off devices, providing better control and efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 72 A

High pulsed drain current rating allows for reliable performance in high current applications.

No. of Terminals: 5

Having 5 terminals allows for versatile connections and configurations in circuit design.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and allows for dense PCB designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance and efficiency in FETs.

Transistor Element Material: SILICON

Silicon is a common and reliable material for FET elements, ensuring good performance and longevity.

Maximum Drain Current (ID): 18 A

High maximum drain current rating allows for reliable performance in high current applications.

Maximum Drain-Source On Resistance: 0.0085 ohm

Low ON-resistance helps in reducing power loss and improving efficiency in switching applications.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit design and connection options.

Case Connection: DRAIN

Drain case connection is commonly used and allows for easy heat dissipation, enhancing the reliability of the FET.

Technical Specifications

Power Field Effect Transistors (FET) STL70N2LLH5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

18 A

Maximum Drain-Source On Resistance:

.0085 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-N5

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

72 A

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL70N2LLH5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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