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STL75NH3LL

STMicroelectronics

STL75NH3LL by STMicroelectronics

STL75NH3LL by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 75 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Ideal for compact power management in modern electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,973 parts In-Stock

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1,973

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Anansix

USA . 1,582 parts In-Stock

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Digiode

USA . 104 parts In-Stock

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104

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IDEA Electronic Components Group

UK . 877 parts In-Stock

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$0.650

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$0.585

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877

$0.650

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$0.585

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MKK Technologies

India . 217 parts In-Stock

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$1.221

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217

$1.221

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DigiPath Technology Company

USA . 217 parts In-Stock

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$1.221

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217

$1.221

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Ampacity Inc.

Singapore . 533 parts In-Stock

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$4.050

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533

$4.050

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AZTECH Wire

Italy . 686 parts In-Stock

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$8.040

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686

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Perfect Parts

USA . 6,720 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,542 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,457 parts In-Stock

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Corphita

USA . 3,250 parts In-Stock

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Parana Technologies

USA . 875 parts In-Stock

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$0.777

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Authorized Procurement Solutions

USA . 264 parts In-Stock

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Kepictronics

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Overview

Elevate your designs with the STL75NH3LL from STMicroelectronics, a premier choice in power FET technology. Renowned for exceptional reliability and efficiency, this N-channel transistor excels in demanding switching applications, handling up to 75A with minimal resistance. Whether you're powering automotive systems or industrial equipment, trust STMicroelectronics' legacy of innovation to deliver unparalleled performance and long-lasting value for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances the durability and reliability of the transistor in various operating environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are preferred for their higher efficiency and faster switching capabilities, making them ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides added protection against reverse voltage, simplifying circuit design and enhancing device longevity.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently control power flow in various electronic circuits.

Surface Mount: YES

Surface mount technology allows for smaller, more efficient designs, facilitating higher component density on PCBs.

Minimum DS Breakdown Voltage: 30 V

This minimum breakdown voltage ensures reliable operation under various known load conditions.

Package Shape: RECTANGULAR

The rectangular shape aids in space-efficient layout on circuit boards, promoting better design flexibility.

Terminal Form: NO LEAD

No lead configuration reduces the footprint and improves thermal performance, which is critical in high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low standby power consumption, contributing to energy efficiency.

Maximum Pulsed Drain Current (IDM): 80 A

This high pulsed current capability enables the device to handle transient loads effectively without failure.

Maximum Drain Current (Abs) (ID): 75 A

A high maximum drain current rating allows this FET to be utilized in demanding applications, providing robustness.

No. of Terminals: 5

Five terminals provide flexibility in circuit design, supporting complex configurations for various applications.

Maximum Power Dissipation (Abs): 60 W

With a high power dissipation capability, this FET can operate in high-power systems safely and efficiently.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes space requirement on PCBs, making it suitable for compact electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides excellent switching speeds and higher efficiency compared to traditional transistors.

Maximum Operating Temperature: 150 °C

A high operating temperature rating ensures reliability in extreme conditions, broadening application potential.

Transistor Element Material: SILICON

Silicon as the element material is standard in FET applications, offering good electrical performance and stability.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and offers good corrosion resistance, ensuring long-term performance.

Maximum Drain Current (ID): 20 A

This specification indicates the typical current capacity, suitable for a wide range of common applications.

Maximum Drain-Source On Resistance: 0.0075 ohm

Low on-resistance contributes to lower power loss during operation, improving overall circuit efficiency.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layouts and enhances thermal dissipation for improved performance.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates a moderate approach to moisture handling, making it suitable for specific packaging and handling protocols.

Case Connection: DRAIN

Direct drain connection enhances thermal management and minimizes parasitic inductance in high-speed applications.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time is ideal for ensuring robust solder joints without compromising component integrity.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C accommodates modern assembly techniques while ensuring protection against thermal damage.

Technical Specifications

Power Field Effect Transistors (FET) STL75NH3LL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

LOW THRESHOLD

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.0075 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL75NH3LL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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