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STL260N3LLH6

STMicroelectronics

STL260N3LLH6 by STMicroelectronics

STL260N3LLH6 by STMicroelectronics is a powerful N-channel FET designed for high-performance applications. It supports a max drain current of 260 A and power dissipation of 166 W, operating up to 175 °C. Ideal for efficient power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,330 parts In-Stock

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6,330

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Digiode

USA . 2,878 parts In-Stock

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2,878

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Anansix

USA . 2,466 parts In-Stock

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2,466

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Chip Stock

USA . 1,125 parts In-Stock

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1,125

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 599 parts In-Stock

1+ parts

$0.995

100+ parts

-

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$0.895

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-

599

$0.995

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$0.895

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MKK Technologies

India . 767 parts In-Stock

1+ parts

$1.870

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-

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767

$1.870

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DigiPath Technology Company

USA . 767 parts In-Stock

1+ parts

$1.870

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-

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767

$1.870

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Andel Nordic

Denmark . 3,137 parts In-Stock

1+ parts

$3.888

100+ parts

-

1k+ parts

$3.733

10k+ parts

$3.733

3,137

$3.888

-

$3.733

$3.733

AZTECH Wire

Italy . 816 parts In-Stock

1+ parts

$20.490

100+ parts

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816

$20.490

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Kepictronics

USA . 306,000 parts In-Stock

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306,000

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Alle Elektronik GmbH

Germany . 3,980 parts In-Stock

1+ parts

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3,980

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Corphita

USA . 2,682 parts In-Stock

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2,682

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Parana Technologies

USA . 1,420 parts In-Stock

1+ parts

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$1.189

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1,420

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$1.189

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Overview

Unlock unparalleled performance with the STL260N3LLH6 from STMicroelectronics, a leader in innovation and reliability. This N-channel Power FET combines exceptional quality with robust capabilities—boasting an impressive 260 A drain current and optimal thermal management for high-demand applications. Ideal for power management in automotive, industrial, and consumer electronics, it delivers unmatched efficiency and durability, ensuring your projects thrive with confidence and longevity.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs provide higher electron mobility, leading to lower on-resistance and improved efficiency in power applications.

Configuration: SINGLE

A single configuration simplifies circuit design, reduces space, and minimizes potential failure points, making it reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and automated assembly, enhancing production efficiency and saving board space.

Maximum Drain Current (Abs) (ID): 260 A

With a maximum drain current of 260 A, this FET can handle high power loads, making it ideal for demanding applications.

Maximum Power Dissipation (Abs): 166 W

A high power dissipation rating of 166 W enables the handling of significant power without overheating, ensuring reliability and longevity.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers advantages such as low gate power consumption and high input impedance, making this FET efficient for a variety of applications.

Maximum Operating Temperature: 175 °C

An operating temperature of 175 °C allows for use in high-temperature environments, expanding its application range in tough conditions.

Terminal Finish: MATTE TIN

MATTE TIN terminal finish provides excellent solderability and corrosion resistance, ensuring reliable connections in electronic assemblies.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates compatibility with modern soldering methods, ensuring ease of integration into various manufacturing processes.

Technical Specifications

Power Field Effect Transistors (FET) STL260N3LLH6 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

260 A

Maximum Drain Current (ID):

260 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Trade Compliance

STL260N3LLH6 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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