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STK28N3LLH5

STMicroelectronics

STK28N3LLH5 by STMicroelectronics

STK28N3LLH5 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 28 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Ideal for compact power management in modern electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 2,342 parts In-Stock

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Anansix

USA . 1,566 parts In-Stock

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1,566

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Vyrian

USA . 67 parts In-Stock

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Zilex Electronics Inc.

Canada . 20 parts In-Stock

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IDEA Electronic Components Group

UK . 1,986 parts In-Stock

1+ parts

$1.815

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$1.634

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1,986

$1.815

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$1.634

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MKK Technologies

India . 207 parts In-Stock

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$3.413

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$3.413

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DigiPath Technology Company

USA . 207 parts In-Stock

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$3.413

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207

$3.413

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Component Stockers USA

USA . 761 parts In-Stock

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$99.990

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761

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Corphita

USA . 4,021 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,663 parts In-Stock

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3,663

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Parana Technologies

USA . 107 parts In-Stock

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$2.170

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$2.170

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Overview

Unlock unparalleled performance with the STK28N3LLH5 from STMicroelectronics, a leading innovator in power management solutions. This N-channel FET combines exceptional efficiency and reliability in a compact design, perfect for advanced switching applications. With superior thermal characteristics and robust current handling, it ensures optimal performance in demanding environments. Elevate your projects with the trust of a market leader and experience seamless integration and enhanced productivity.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel transistors are typically preferred for switching applications due to their lower on-resistance, leading to higher efficiency and better thermal performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for better protection against reverse polarity and increases reliability in applications that require inductive loads.

Transistor Application: SWITCHING

Designed explicitly for switching applications, this FET can rapidly turn on and off, making it ideal for modern electronic circuits requiring fast response times.

Surface Mount: YES

Surface mount compatibility facilitates easier integration into compact designs, saving space and reducing assembly costs.

Minimum DS Breakdown Voltage: 30 V

This higher breakdown voltage enhances the transistor's robustness in high-voltage applications, ensuring reliable operation under varying conditions.

Package Shape: RECTANGULAR

The rectangular package shape is optimized for efficient thermal management and PCB layout flexibility.

Terminal Form: NO LEAD

No lead design simplifies the overall footprint and helps in maintaining high-density circuit designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode provides very low power consumption in the off state, making it energy-efficient for battery-powered devices.

Maximum Pulsed Drain Current (IDM): 112 A

A high pulsed drain current rating allows this FET to handle surges and transients effectively, ensuring consistent performance under dynamic conditions.

Avalanche Energy Rating (EAS): 1000 mJ

The ability to withstand high energy avalanche conditions enhances durability and reliability, especially in environments with voltage spikes.

Maximum Drain Current (Abs) (ID): 28 A

A maximum drain current rating of 28 A supports substantial loads, making it suitable for various power applications.

No. of Terminals: 4

Having four terminals offers flexibility in design and makes integration with other components straightforward.

Maximum Power Dissipation (Abs): 5.2 W

The capability to dissipate 5.2 W ensures the device remains cool during operation, reducing thermal management challenges.

Package Style (Meter): SMALL OUTLINE

The small outline package enables high-density board designs while maintaining effective thermal performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and fast switching capability, essential for modern digital and analog circuits.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C allows this FET to be deployed in high-temperature environments without performance degradation.

Transistor Element Material: SILICON

Silicon-based transistors benefit from a well-established technology with proven performance and reliability.

Terminal Finish: MATTE TIN

A matte tin finish provides good solderability and corrosion resistance, enhancing reliability over time.

Maximum Drain Current (ID): 28 A

With dual listings of maximum drain current, the consistency in specifications indicates reliability in handling high loads.

Maximum Drain-Source On Resistance: 0.0043 ohm

A low on-resistance minimizes power loss during operation, improving overall efficiency and reducing heat generation.

Terminal Position: DUAL

Dual terminal positions enhance routing options on PCBs, providing greater design flexibility.

Case Connection: DRAIN

A drain connection ensures effective heat dissipation by allowing direct attachment to a heatsink if needed.

Technical Specifications

Power Field Effect Transistors (FET) STK28N3LLH5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1000 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

28 A

Maximum Drain Current (ID):

28 A

Maximum Drain-Source On Resistance:

.0043 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-N4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

112 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STK28N3LLH5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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