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STK20N75F3

STMicroelectronics

STK20N75F3 by STMicroelectronics

STK20N75F3 from STMicroelectronics is an N-channel FET ideal for switching applications, featuring a 75V breakdown voltage and 80A max pulsed drain current. Its compact no-lead design ensures efficient thermal management with a max temp of 150 °C. This MOSFET offers low on-resistance at just 0.007Ω, making it suitable for high-performance power circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,242 parts In-Stock

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4,242

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Digiode

USA . 1,432 parts In-Stock

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1,432

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Anansix

USA . 584 parts In-Stock

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584

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 725 parts In-Stock

1+ parts

$1.831

100+ parts

-

1k+ parts

$1.648

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-

725

$1.831

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$1.648

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MKK Technologies

India . 2,328 parts In-Stock

1+ parts

$3.443

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2,328

$3.443

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DigiPath Technology Company

USA . 2,328 parts In-Stock

1+ parts

$3.443

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2,328

$3.443

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AZTECH Wire

Italy . 226 parts In-Stock

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$21.580

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226

$21.580

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Component Stockers USA

USA . 730 parts In-Stock

1+ parts

$99.990

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730

$99.990

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Alle Elektronik GmbH

Germany . 3,524 parts In-Stock

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3,524

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Corphita

USA . 2,031 parts In-Stock

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2,031

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Parana Technologies

USA . 1,680 parts In-Stock

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$2.189

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1,680

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$2.189

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Overview

Unlock unparalleled performance with the STK20N75F3 from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for efficient switching applications, this N-channel power FET ensures reliable operation even under demanding conditions. Its compact, surface-mount design simplifies integration, while the built-in diode offers added reliability. Experience exceptional durability and efficiency that enhances your projects, making it the ideal choice for automotive, industrial, and consumer electronics.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-Channel transistors are generally preferred for high-speed and high-efficiency applications, making this product suitable for advanced electronic designs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode offers additional protection and functionality for various applications, enhancing overall reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient control of electrical power in various devices.

Surface Mount: YES

The surface mount capability allows for easier integration into compact designs, saving space on circuit boards.

Minimum DS Breakdown Voltage: 75 V

A breakdown voltage of 75V provides robust performance in high-voltage applications, ensuring reliability even under stress.

Package Shape: RECTANGULAR

The rectangular package shape contributes to efficient thermal management and ease of layout in PCB designs.

Terminal Form: NO LEAD

No-lead design minimizes stray inductance and resistance, which improves overall electrical performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures low off-state current and high on-state efficiency, making it ideal for modern applications.

Maximum Pulsed Drain Current (IDM): 80 A

Ability to handle high pulsed currents makes this FET suitable for applications with high inrush current demands.

Avalanche Energy Rating (EAS): 600 mJ

A high avalanche energy rating indicates robust protection against transients, increasing the operational reliability of the device.

Maximum Drain Current (Abs) (ID): 20 A

Supports significant continuous current levels, making it suitable for high-power applications.

No. of Terminals: 4

The 4-terminal configuration facilitates versatile connection options for circuit designs.

Maximum Power Dissipation (Abs): 5.2 W

With a maximum power dissipation rate of 5.2W, this FET is efficient while managing heat effectively.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, providing flexibility in design.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for fast switching speeds and low power consumption, essential for power management applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature indicates reliability in extreme environments, suitable for demanding applications.

Transistor Element Material: SILICON

Silicon as the transistor material ensures good thermal and electrical performance, making it an industry standard.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and corrosion resistance, enhancing durability in assembly processes.

Maximum Drain Current (ID): 20 A

Repeated specification of 20A highlights its capability in high-load designs, confirming its robustness.

Maximum Drain-Source On Resistance: 0.007 ohm

Very low on-resistance results in minimal energy loss during operation, improving efficiency in power applications.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout options on PCBs, accommodating varied design requirements.

Case Connection: DRAIN

Direct drain connection facilitates efficient power delivery and thermal management in the circuit.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures compatibility with standard soldering processes, simplifying manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature compatibility ensures reliable soldering performance, critical for device longevity.

Technical Specifications

Power Field Effect Transistors (FET) STK20N75F3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

600 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

75 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.007 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-N4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STK20N75F3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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