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STK22N06

STMicroelectronics

STK22N06 by STMicroelectronics

STK22N06 by STMicroelectronics is an N-channel FET ideal for switching applications, featuring a max drain current of 22 A and a breakdown voltage of 60 V. It operates in enhancement mode with a power dissipation of up to 65 W. Its compact design ensures efficient thermal management in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,398 parts In-Stock

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1,398

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Vyrian

USA . 704 parts In-Stock

1+ parts

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704

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Anansix

USA . 198 parts In-Stock

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198

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,080 parts In-Stock

1+ parts

$1.602

100+ parts

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1k+ parts

$1.442

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2,080

$1.602

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$1.442

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MKK Technologies

India . 1,634 parts In-Stock

1+ parts

$3.012

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1,634

$3.012

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DigiPath Technology Company

USA . 1,634 parts In-Stock

1+ parts

$3.012

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1,634

$3.012

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Parana Technologies

USA . 493 parts In-Stock

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$1.915

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493

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$1.915

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Corphita

USA . 349 parts In-Stock

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349

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Overview

Elevate your designs with the STK22N06 from STMicroelectronics, a powerhouse in the world of Power FETs. Renowned for their commitment to innovation and quality, STMicroelectronics delivers reliable performance tailored for efficient switching applications. This N-channel transistor boasts impressive durability and efficiency, making it ideal for automotive, industrial, and consumer electronics. Discover unparalleled value and dependability with STMicroelectronics, where excellence meets cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliability and protection for the internal components, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically provide better performance and efficiency for switching applications, leading to improved circuit effectiveness.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode offers enhanced protection against reverse voltage spikes, making it ideal for applications where bidirectional current may occur.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides optimized performance for rapidly turning on and off.

Minimum DS Breakdown Voltage: 60 V

This breakdown voltage provides a robust operating range, allowing the FET to handle higher voltages without failure.

Package Shape: RECTANGULAR

The rectangular shape facilitates easier PCB layouts and better space efficiency, ensuring fitment in compact designs.

Terminal Form: THROUGH-HOLE

Through-hole technology ensures strong mechanical connections, making it suitable for high-reliability applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for the FET to operate with higher efficiency and lower power dissipation in active modes.

Maximum Pulsed Drain Current (IDM): 88 A

The ability to handle high pulsed drain current makes this FET suitable for applications requiring brief, high-current pulses.

Avalanche Energy Rating (EAS): 100 mJ

A high avalanche energy rating enhances the robustness of the FET, making it resilient against energy spikes and transient conditions.

Maximum Drain Current (Abs) (ID): 22 A

This maximum current capacity meets the demands of various power applications, ensuring reliable performance under load.

No. of Terminals: 3

Three terminals provide necessary connections for efficient circuit integration and simplified designs.

Maximum Power Dissipation (Abs): 65 W

High power dissipation capability allows for effective heat management, maintaining performance in high-power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for secure mounting and greater heat dissipation, ideal for stable installation in power systems.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides high efficiency and fast switching speeds, making it suitable for a wide range of electronic applications.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature allows for flexibility in varying environmental conditions, enhancing reliability.

Transistor Element Material: SILICON

Silicon as the element material contributes to the FET's good electrical characteristics and stability.

Terminal Finish: MATTE TIN

The matte tin finish helps in preventing oxidation, improving long-term durability and connection quality.

Maximum Drain Current (ID): 22 A

Repeating the maximum drain current specification emphasizes its suitability for high-load applications.

Maximum Drain-Source On Resistance: 0.065 ohm

Low on-resistance reduces power losses during operation, enhancing overall system efficiency.

Terminal Position: SINGLE

A single terminal position simplifies design and integration into existing systems.

Technical Specifications

Power Field Effect Transistors (FET) STK22N06 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

100 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

88 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STK22N06 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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