Loading...

STK24N4LLF5

STMicroelectronics

STK24N4LLF5 by STMicroelectronics

STK24N4LLF5 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 24 A, a breakdown voltage of 40 V, and low on-resistance of 0.0065 Ω. Ideal for compact power management in modern electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,860 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,860

-

-

-

-

Vyrian

USA . 1,403 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,403

-

-

-

-

Anansix

USA . 859 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

859

-

-

-

-

Zilex Electronics Inc.

Canada . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 122 parts In-Stock

1+ parts

$1.196

100+ parts

-

1k+ parts

$1.076

10k+ parts

-

122

$1.196

-

$1.076

-

MKK Technologies

India . 851 parts In-Stock

1+ parts

$2.249

100+ parts

-

1k+ parts

-

10k+ parts

-

851

$2.249

-

-

-

DigiPath Technology Company

USA . 851 parts In-Stock

1+ parts

$2.249

100+ parts

-

1k+ parts

-

10k+ parts

-

851

$2.249

-

-

-

Corphita

USA . 3,735 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,735

-

-

-

-

Parana Technologies

USA . 603 parts In-Stock

1+ parts

-

100+ parts

$1.430

1k+ parts

-

10k+ parts

-

603

-

$1.430

-

-

Overview

Unlock unmatched efficiency with the STK24N4LLF5 from STMicroelectronics, a leader in innovative semiconductor solutions. This N-Channel Power FET is engineered for optimal switching performance, making it ideal for a range of applications—from power management to motor control. With its compact design and built-in diode, it offers exceptional reliability and low on-resistance, ensuring enhanced system performance. Experience the quality and innovation that STMicroelectronics brings to your projects!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are typically preferred for their efficient electron mobility, making them suitable for high-speed switching applications.

Configuration: Single with Built-In Diode

The built-in diode provides added protection and convenience by ensuring reverse current flow can be handled safely, simplifying circuit design.

Transistor Application: Switching

Designed specifically for switching applications, this FET can handle rapid on/off cycles effectively, enhancing overall system performance.

Surface Mount: Yes

Surface mount capability allows for compact design and easier integration into modern PCB layouts, contributing to reduced space requirements.

Minimum DS Breakdown Voltage: 40 V

A minimum breakdown voltage of 40 V provides reliable performance under high-voltage conditions, ensuring robustness in various applications.

Package Shape: Rectangular

The rectangular package shape is versatile and efficient, facilitating better space utilization on the PCB.

Terminal Form: No Lead

No lead design minimizes footprint and improves heat dissipation, which is crucial for maintaining performance in high-current situations.

Operating Mode: Enhancement Mode

Enhancement mode operation ensures the FET is off at zero gate voltage, allowing for power savings and additional control in circuit designs.

Maximum Pulsed Drain Current (IDM): 96 A

With a maximum pulsed drain current of 96 A, this FET can handle peak currents effectively, making it suitable for demanding applications.

No. of Terminals: 4

Four terminals provide flexibility in circuit design, allowing for various configurations and connections to meet different design needs.

Package Style (Meter): Small Outline

The small outline package style is excellent for space-constrained applications, allowing for high-density component layouts.

Field Effect Transistor Technology: Metal-Oxide Semiconductor

MOS technology benefits from high input impedance and low power consumption, making it ideal for a wide range of electronic applications.

Transistor Element Material: Silicon

Silicon is a proven and reliable semiconductor material, ensuring durability and consistent performance in various environments.

Terminal Finish: Matte Tin

Matte tin terminal finish provides good solderability and resistance to corrosion, ensuring long-term reliability in electronic connections.

Maximum Drain Current (ID): 24 A

A maximum drain current of 24 A makes this FET suitable for high power applications, enabling it to efficiently manage loads.

Maximum Drain-Source On Resistance: 0.0065 Ohm

A low on-resistance of 0.0065 Ohm minimizes power loss when the transistor is on, enhancing overall efficiency and thermal performance.

Terminal Position: Dual

Dual terminal position allows for simplicity in layout design and can aid in better thermal management during operation.

Case Connection: Drain

Having the case connected to the drain enables efficient heat dissipation and simplifies design choices for applications involving high power.

Technical Specifications

Power Field Effect Transistors (FET) STK24N4LLF5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

24 A

Maximum Drain-Source On Resistance:

.0065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-N4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

96 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STK24N4LLF5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19