Loading...

STK16N05(SOT-194)

STMicroelectronics

STK16N05(SOT-194) by STMicroelectronics

STK16N05(SOT-194) by STMicroelectronics is a N-channel Power FET with 50V DS breakdown voltage, 64A IDM, and 0.09 ohm RDS(on). Ideal for switching applications, it operates in enhancement mode with 150 °C max temp. Suitable for surface mount design, this MOSFET has a built-in diode and offers high power dissipation at 50W.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,524 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,524

-

-

-

-

Anansix

USA . 2,640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,640

-

-

-

-

Digiode

USA . 1,801 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,801

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 735 parts In-Stock

1+ parts

$0.572

100+ parts

-

1k+ parts

$0.515

10k+ parts

-

735

$0.572

-

$0.515

-

MKK Technologies

India . 711 parts In-Stock

1+ parts

$1.076

100+ parts

-

1k+ parts

-

10k+ parts

-

711

$1.076

-

-

-

DigiPath Technology Company

USA . 711 parts In-Stock

1+ parts

$1.076

100+ parts

-

1k+ parts

-

10k+ parts

-

711

$1.076

-

-

-

Corphita

USA . 3,597 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,597

-

-

-

-

Parana Technologies

USA . 1,399 parts In-Stock

1+ parts

-

100+ parts

$0.684

1k+ parts

-

10k+ parts

-

1,399

-

$0.684

-

-

Overview

Upgrade your power systems with the STK16N05(SOT-194) by STMicroelectronics. This N-channel Power FET boasts high quality and reliability, perfect for switching applications. With a maximum pulsing current of 64A and a low on-resistance of 0.09 ohms, this transistor offers exceptional performance. Its flange mount package and isolated case connection make integration easy. Trust in STMicroelectronics for cutting-edge technology that delivers value and efficiency to your projects. Experience the benefits of enhanced power management with the STK16N05(SOT-194).

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to mechanical stress, ensuring reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower on-resistance and higher efficiency compared to P-channel transistors, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and protects against reverse currents, enhancing overall efficiency and reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast turn-on and turn-off times for efficient operation.

Surface Mount: YES

Surface mount design allows for easy and compact integration into electronic circuits, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 50 V

High breakdown voltage allows for operation in systems with higher voltages, providing increased flexibility and robustness.

Package Shape: RECTANGULAR

Rectangular shape provides a standardized form factor for easy integration into various electronic setups and designs.

Maximum Pulsed Drain Current (IDM): 64 A

High pulsed drain current capability enables the transistor to handle momentary high-current spikes without damage, improving reliability in dynamic operating conditions.

Avalanche Energy Rating (EAS): 50 mJ

Avalanche energy rating indicates the transistor's ability to withstand high-energy pulses, making it suitable for rugged applications where overvoltage protection is critical.

No. of Terminals: 3

Three terminals provide the necessary connections for power, control, and ground, enabling simple and efficient circuit design.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers mechanical stability and easy mounting options, ensuring secure installation in various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high switching speeds, low input capacitance, and high input impedance, facilitating efficient switching performance.

Maximum Power Dissipation Ambient: 50 W

High power dissipation rating allows the transistor to handle significant power loads without overheating, ensuring reliable operation under varying ambient conditions.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance enables the transistor to function in elevated temperatures, making it suitable for industrial and automotive applications.

Transistor Element Material: SILICON

Silicon material offers high reliability, temperature stability, and efficient performance, making it a popular choice for power transistors.

Maximum Turn On Time (ton): 95 ns

Fast turn-on time ensures quick response in switching applications, minimizing power loss and improving efficiency.

Maximum Drain Current (ID): 16 A

High drain current rating allows the transistor to handle substantial current flow, making it suitable for high-power switching applications.

Maximum Drain-Source On Resistance: 0.09 ohm

Low drain-source on resistance results in minimal power dissipation, high efficiency, and reduced heat generation during operation.

Terminal Position: SINGLE

Single terminal position simplifies connection and layout considerations, enhancing ease of use and integration in circuit designs.

Case Connection: ISOLATED

Isolated case connection ensures electrical separation and prevents unwanted interference or short-circuits, enhancing overall safety and reliability.

Maximum Feedback Capacitance (Crss): 150 pF

Low feedback capacitance reduces the risk of parasitic oscillations and enhances stability, ensuring reliable performance in high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) STK16N05(SOT-194) attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

50 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

50 V

Maximum Drain Current (ID):

16 A

Maximum Drain-Source On Resistance:

.09 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

150 pF

JESD-30 Code:

R-PSFM-G3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

50 W

Maximum Pulsed Drain Current (IDM):

64 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn On Time (ton):

95 ns

Trade Compliance

STK16N05(SOT-194) Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19