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STK17N10

STMicroelectronics

STK17N10 by STMicroelectronics

STK17N10 by STMicroelectronics is an N-channel FET designed for switching applications, featuring a max drain current of 17 A and a breakdown voltage of 100 V. It offers low on-resistance at 0.11 Ω and operates up to 175 °C. Ideal for power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,417 parts In-Stock

1+ parts

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3,417

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Anansix

USA . 1,754 parts In-Stock

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1,754

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Digiode

USA . 1,223 parts In-Stock

1+ parts

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1,223

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 655 parts In-Stock

1+ parts

$0.546

100+ parts

-

1k+ parts

$0.492

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655

$0.546

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$0.492

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MKK Technologies

India . 126 parts In-Stock

1+ parts

$1.028

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126

$1.028

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DigiPath Technology Company

USA . 126 parts In-Stock

1+ parts

$1.028

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126

$1.028

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Corphita

USA . 579 parts In-Stock

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579

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Parana Technologies

USA . 127 parts In-Stock

1+ parts

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100+ parts

$0.653

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127

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$0.653

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Overview

Unlock your project's full potential with the STK17N10 from STMicroelectronics, a leader in innovation and quality. This N-channel power FET combines exceptional durability and efficiency, perfect for switching applications in various fields, from industrial automation to renewable energy systems. With its robust design and high performance, it delivers reliable operation even under challenging conditions, ensuring you get the best value and peace of mind. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package ensures durability and reliability, making the transistor suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower on-resistance and better efficiency, making them ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional protection and enhances usage flexibility in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for high-speed operation and efficiency.

Minimum DS Breakdown Voltage: 100 V

A high breakdown voltage allows for safe operation in demanding environments, providing reliability in high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into circuits while preserving space and layout efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and reliable connections in various electronic circuits.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers better control and responsiveness in switching applications, enhancing overall performance.

Maximum Pulsed Drain Current (IDM): 68 A

The high pulsed drain current rating allows this transistor to handle short bursts of high current, suitable for demanding applications.

Avalanche Energy Rating (EAS): 80 mJ

A high avalanche energy rating indicates resilience to voltage spikes, which adds reliability in various operating conditions.

Maximum Drain Current (Abs) (ID): 17 A

The substantial maximum drain current capability allows this FET to be used in high-power circuits without overheating.

No. of Terminals: 3

The three-terminal design simplifies circuit integration while providing necessary control and connection options.

Maximum Power Dissipation (Abs): 65 W

High power dissipation capability means the FET can operate efficiently within demanding heating scenarios.

Package Style (Meter): FLANGE MOUNT

Flange mount packages enhance mechanical stability and simplify mounting in various electronic systems.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for lower power consumption and higher efficiency, ideal for modern electronic devices.

Maximum Power Dissipation Ambient: 60 W

This rating ensures that the FET can function reliably in ambient conditions without the risk of overheating.

Maximum Operating Temperature: 175 °C

The high operating temperature rating allows the FET to function effectively in extreme conditions, improving its versatility.

Transistor Element Material: SILICON

Silicon is a standard material known for its excellent electronic properties, promoting reliability and performance.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides corrosion resistance and good solderability for reliable connections.

Maximum Drain Current (ID): 17 A

Consistent with the capability to handle significant current, ensuring dependable performance in power circuits.

Maximum Drain-Source On Resistance: 0.11 ohm

Low on-resistance reduces heat generation and improves efficiency in power applications.

Terminal Position: SINGLE

Single terminal positioning simplifies installation and integration into various circuit designs.

Case Connection: ISOLATED

Isolated case connection ensures safety and prevents short circuits, increasing product reliability.

Technical Specifications

Power Field Effect Transistors (FET) STK17N10 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

80 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

17 A

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

60 W

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

68 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STK17N10 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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