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STK12N06L(SOT-194)

STMicroelectronics

STK12N06L(SOT-194) by STMicroelectronics

STK12N06L(SOT-194) by STMicroelectronics is a N-channel Power FET with 60V DS breakdown voltage, 48A IDM, and 0.15 ohm RDS(on). It's used for switching applications in enhancement mode with 50W max power dissipation.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,910 parts In-Stock

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1,910

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Anansix

USA . 806 parts In-Stock

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806

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Vyrian

USA . 752 parts In-Stock

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752

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,883 parts In-Stock

1+ parts

$0.733

100+ parts

-

1k+ parts

$0.660

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1,883

$0.733

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$0.660

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MKK Technologies

India . 2,100 parts In-Stock

1+ parts

$1.379

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$1.379

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DigiPath Technology Company

USA . 2,100 parts In-Stock

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$1.379

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2,100

$1.379

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Parana Technologies

USA . 1,086 parts In-Stock

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$0.877

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1,086

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$0.877

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Corphita

USA . 416 parts In-Stock

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416

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Overview

Unleash the power of innovation with the STK12N06L(SOT-194) by STMicroelectronics. As a leading manufacturer of Power Field Effect Transistors, STMicroelectronics ensures top-notch quality and reliability in every product. Ideal for switching applications, this N-channel transistor offers enhanced performance and efficiency. With a maximum pulsed drain current of 48A and a minimum DS breakdown voltage of 60V, this transistor is designed to meet your power needs. Trust STMicroelectronics for cutting-edge technology that delivers superior results. Elevate your projects with the STK12N06L(SOT-194) today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and resistant to external elements, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speed, making them ideal for various applications including power electronics and motor control.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy and efficient current flow control in one package, simplifying circuit design and reducing component count.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high performance and reliability in controlling power flow in electronic circuits.

Surface Mount: YES

Being surface mount compatible makes installation and assembly easier, especially for mass production and automated processes.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this FET can handle higher voltages, making it suitable for a wide range of applications requiring voltage regulation and control.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and placement on circuit boards, optimizing space and ensuring efficient heat dissipation.

Maximum Pulsed Drain Current (IDM): 48 A

The high pulsed drain current rating of 48A means this FET can handle peak power loads and surge currents without overheating or failing.

No. of Terminals: 3

Having 3 terminals simplifies the connection and control of the FET in a circuit, reducing complexity and improving reliability.

Package Style (Meter): FLANGE MOUNT

The flange mount style provides secure mounting and efficient heat dissipation, ensuring stable operation even under high power loads.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low on-resistance and high switching speeds, making this FET ideal for high-frequency and high-power applications.

Maximum Power Dissipation Ambient: 50 W

With a maximum power dissipation of 50W, this FET can handle significant power levels without overheating, ensuring reliable performance even in demanding conditions.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C allows this FET to operate in elevated temperature environments without degradation in performance.

Transistor Element Material: SILICON

Silicon-based FETs offer higher efficiency, faster switching speeds, and better thermal stability, making them a reliable choice for various power electronics applications.

Maximum Turn On Time (ton): 100 ns

The fast turn-on time of 100ns ensures quick response and high-speed switching, making this FET suitable for applications requiring rapid power control.

Maximum Drain Current (ID): 12 A

With a maximum drain current rating of 12A, this FET can handle high continuous currents, making it ideal for power distribution and control.

Maximum Drain-Source On Resistance: 0.15 ohm

The low drain-source on-resistance of 0.15 ohm minimizes power losses and improves efficiency in power switching applications, leading to higher performance.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation and connection of the FET in a circuit, reducing chances of error and improving reliability.

Case Connection: ISOLATED

The isolated case connection ensures proper insulation and protection against electrical interference, enhancing the overall safety and reliability of the FET.

Maximum Feedback Capacitance (Crss): 100 pF

The low feedback capacitance of 100pF reduces signal distortion and improves high-frequency performance, making this FET suitable for applications requiring precise signal control.

Technical Specifications

Power Field Effect Transistors (FET) STK12N06L(SOT-194) attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

LOW THRESHOLD

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.15 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

100 pF

JESD-30 Code:

R-PSFM-G3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

50 W

Maximum Pulsed Drain Current (IDM):

48 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn On Time (ton):

100 ns

Trade Compliance

STK12N06L(SOT-194) Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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