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STI30NM60N

STMicroelectronics

STI30NM60N by STMicroelectronics

STI30NM60N by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 600V breakdown voltage, 100A max pulsed drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,413 parts In-Stock

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Digiode

USA . 2,918 parts In-Stock

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Anansix

USA . 2,478 parts In-Stock

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2,478

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IDEA Electronic Components Group

UK . 911 parts In-Stock

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$0.962

100+ parts

-

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$0.866

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911

$0.962

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$0.866

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MKK Technologies

India . 782 parts In-Stock

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$1.810

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DigiPath Technology Company

USA . 782 parts In-Stock

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$1.810

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782

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AZTECH Wire

Italy . 998 parts In-Stock

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$17.600

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998

$17.600

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Component Stockers USA

USA . 302 parts In-Stock

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$99.990

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,199 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,812 parts In-Stock

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Parana Technologies

USA . 447 parts In-Stock

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$1.151

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Corphita

USA . 345 parts In-Stock

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Overview

Elevate your projects with the STI30NM60N from STMicroelectronics, a leader in innovation and quality. This robust N-channel Power FET ensures exceptional performance in demanding switching applications, delivering reliable efficiency and longevity. With its high breakdown voltage and built-in diode, it's perfect for power management in industrial and consumer electronics. Trust in ST's legacy of excellence to power your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and provides effective insulation, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their superior electron mobility, which leads to better performance and efficiency in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode feature offers additional protection against back EMF in inductive loads, making this FET ideal for motor control applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently handle rapid on/off cycles, making it perfect for power management technologies.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage ensures reliability and safety in high-voltage applications, allowing for versatile deployment in different circuits.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on PCBs, enabling compact designs while maintaining performance.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical stability and are easier to solder, ensuring reliable connections in high-stress environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs generally exhibit lower power consumption and higher efficiency during operation, making them advantageous for energy-efficient designs.

Maximum Pulsed Drain Current (IDM): 100 A

Capable of handling high pulsed currents allows this FET to efficiently manage transient loads, which is essential in many power applications.

Avalanche Energy Rating (EAS): 900 mJ

The high avalanche energy rating enhances the FET’s ability to withstand voltage spikes, ensuring greater longevity and reliability in circuits.

Maximum Drain Current (Abs) (ID): 25 A

This allows the FET to effectively drive loads up to 25 A stable under various conditions, making it versatile for many applications.

No. of Terminals: 3

A simple three-terminal setup is user-friendly and easy to integrate into various designs, minimizing complexity while ensuring effective performance.

Maximum Power Dissipation (Abs): 190 W

The capability to dissipate high power makes this FET suitable for high-power applications without overheating.

Package Style (Meter): IN-LINE

In-line package style simplifies integration into printed circuit boards, saving space and allowing for neat assembly.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides advantages such as high input impedance and faster switching speeds, enhancing the performance of the FET in diverse applications.

Maximum Operating Temperature: 150 °C

The ability to operate at high temperatures increases reliability in high-heat environments, making it suitable for automotive and industrial applications.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its reliability and effectiveness in power electronics, contributing to consistent performance.

Maximum Drain Current (ID): 25 A

This FET can sustain up to 25 A of continuous current, making it adaptable for various high-load applications.

Maximum Drain-Source On Resistance: 0.13 ohm

A low on-resistance reduces power losses during operation, enhancing efficiency and thermal management in power circuits.

Terminal Position: SINGLE

Single terminal position allows for simplified circuit design and easier debugging or replacement in electronic systems.

Technical Specifications

Power Field Effect Transistors (FET) STI30NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

900 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

25 A

Maximum Drain Current (ID):

25 A

Maximum Drain-Source On Resistance:

.13 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

100 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STI30NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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