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STI34N65M5

STMicroelectronics

STI34N65M5 by STMicroelectronics

STI34N65M5 by STMicroelectronics is a N-CHANNEL FET with 650V DS breakdown voltage, ideal for switching applications. It features 112A max pulsed drain current and 0.11 ohm max drain-source resistance. This MOSFET operates in enhancement mode at up to 150 °C, making it suitable for high-power tasks.

Median Price

$5.292

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,927 parts In-Stock

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Vyrian

USA . 11,057 parts In-Stock

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Anansix

USA . 1,263 parts In-Stock

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Flip Electronics

USA . 1,200 parts In-Stock

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R&J Components

USA . 624 parts In-Stock

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IDEA Electronic Components Group

UK . 1,319 parts In-Stock

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$0.957

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$0.861

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$0.957

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$0.861

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MKK Technologies

India . 415 parts In-Stock

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$1.799

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415

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DigiPath Technology Company

USA . 415 parts In-Stock

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$1.799

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415

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Corphita

USA . 4,818 parts In-Stock

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$5.013

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 10,860 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Microchip USA

USA . 4,746 parts In-Stock

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Perfect Parts

USA . 3,564 parts In-Stock

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Parana Technologies

USA . 1,683 parts In-Stock

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$1.144

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 991 parts In-Stock

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991

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Overview

Looking for a reliable and high-quality Power Field Effect Transistor (FET)? Look no further than the STI34N65M5 by STMicroelectronics. With its N-CHANNEL polarity and SINGLE configuration with built-in diode, this transistor is perfect for switching applications. Boasting a minimum DS Breakdown Voltage of 650V and a maximum Drain Current of 28A, this transistor offers exceptional performance and durability. Trust in STMicroelectronics' expertise in semiconductor technology and enhance your electronic designs with the STI34N65M5.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good mechanical strength and insulation properties, ensuring durability and safety in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer better performance and efficiency compared to P-channel FETs, making it a preferred choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protects against back EMF, improving reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast switching speeds and efficient performance.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltage applications effectively.

Maximum Pulsed Drain Current (IDM): 112 A

Capable of handling high current pulses, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 510 mJ

Provides protection against avalanches and ensures reliable operation even under stressful conditions.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance, suitable for industrial and automotive applications.

Maximum Drain Current (ID): 28 A

Capable of handling high continuous current, making it suitable for various power applications.

Maximum Drain-Source On Resistance: 0.11 ohm

Low on-resistance allows for efficient power transfer and reduced heat dissipation, improving overall efficiency.

Technical Specifications

Power Field Effect Transistors (FET) STI34N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

510 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

28 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

112 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STI34N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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