Loading...

STFI13N65M2

STMicroelectronics

STFI13N65M2 by STMicroelectronics

STFI13N65M2 by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 650V breakdown voltage, 40A max pulsed drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

$0.951

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,318 parts In-Stock

1+ parts

$0.806

100+ parts

-

1k+ parts

-

10k+ parts

-

1,318

$0.806

-

-

-

Chip1Stop

Japan . 1,318 parts In-Stock

1+ parts

$0.951

100+ parts

-

1k+ parts

-

10k+ parts

-

1,318

$0.951

-

-

-

DigiKey

USA . 1,140 parts In-Stock

1+ parts

$2.980

100+ parts

$1.333

1k+ parts

$0.996

10k+ parts

-

1,140

$2.980

$1.333

$0.996

-

Verical

USA . 1,318 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,318

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,394 parts In-Stock

1+ parts

$0.434

100+ parts

-

1k+ parts

-

10k+ parts

-

1,394

$0.434

-

-

-

Vyrian

USA . 2,809 parts In-Stock

1+ parts

$0.453

100+ parts

-

1k+ parts

-

10k+ parts

-

2,809

$0.453

-

-

-

Anansix

USA . 2,884 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,884

-

-

-

-

Cyclops Electronics Ltd

UK . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 175 parts In-Stock

1+ parts

$0.411

100+ parts

-

1k+ parts

-

10k+ parts

-

175

$0.411

-

-

-

IDEA Electronic Components Group

UK . 617 parts In-Stock

1+ parts

$1.299

100+ parts

-

1k+ parts

$1.169

10k+ parts

-

617

$1.299

-

$1.169

-

MKK Technologies

India . 784 parts In-Stock

1+ parts

$2.443

100+ parts

-

1k+ parts

-

10k+ parts

-

784

$2.443

-

-

-

DigiPath Technology Company

USA . 784 parts In-Stock

1+ parts

$2.443

100+ parts

-

1k+ parts

-

10k+ parts

-

784

$2.443

-

-

-

Microchip USA

USA . 9,911 parts In-Stock

1+ parts

$13.910

100+ parts

-

1k+ parts

-

10k+ parts

-

9,911

$13.910

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 11,248 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,248

-

-

-

-

Parana Technologies

USA . 2,310 parts In-Stock

1+ parts

-

100+ parts

$1.553

1k+ parts

-

10k+ parts

-

2,310

-

$1.553

-

-

Alle Elektronik GmbH

Germany . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Elevate your power management solutions with the STFI13N65M2 from STMicroelectronics, a leader in semiconductor innovation. This high-quality N-channel FET is designed for efficient switching applications, delivering exceptional performance and reliability. With a robust breakdown voltage of 650V, it ensures optimal durability and efficiency in demanding environments. Trust in STMicroelectronics' expertise to provide you with cutting-edge technology that enhances your projects and drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials enhances durability and thermal resistance, making this FET suitable for long-term applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher electron mobility, resulting in better efficiency and performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

A built-in diode allows for better integration into circuits, facilitating protection against reverse voltage and enhancing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast operation, making it ideal for power management and signal processing.

Minimum DS Breakdown Voltage: 650 V

A high breakdown voltage allows this FET to operate in high voltage applications, providing greater design flexibility.

Package Shape: RECTANGULAR

The rectangular package design aids in efficient space utilization on circuit boards, optimizing layout and assembly.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure secure connections, offering greater mechanical stability and ease of handling during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for a more efficient power consumption profile, making this device suitable for low-power applications.

Maximum Pulsed Drain Current (IDM): 40 A

The capability to handle high pulsed drain current makes this FET suitable for high-performance applications, delivering robust handling under transient conditions.

Avalanche Energy Rating (EAS): 350 mJ

A significant avalanche energy rating indicates the FET's resilience against voltage spikes, making it reliable for various dynamic environments.

Maximum Drain Current (Abs) (ID): 10 A

With a maximum drain current rating of 10 A, this FET is appropriate for moderate power applications without overheating.

No. of Terminals: 3

The compact 3-terminal configuration simplifies circuit design while maintaining necessary functionality.

Maximum Power Dissipation (Abs): 25 W

A power dissipation capacity of 25 W allows for effective thermal management in high power applications, minimizing the risk of thermal failure.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides ease of installation and better thermal dissipation, making it suitable for high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables low gate power requirement and high-speed operation, suitable for modern electronic devices.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures reliable performance in harsh environments, extending the device's usability.

Transistor Element Material: SILICON

Silicon as the material facilitates excellent electrical characteristics, ensuring reliability and efficiency for various applications.

Maximum Drain Current (ID): 10 A

This reinforces the device's capacity for moderate power applications, ensuring consistent performance.

Maximum Drain-Source On Resistance: 0.43 ohm

Low on-resistance helps in reducing conduction losses, enhancing overall efficiency in power applications.

Terminal Position: SINGLE

A single terminal position aids in simplified PCB layout and assembly without compromising performance.

Case Connection: ISOLATED

Isolated case connections enhance safety by reducing the risk of unintended shorts or connections to the circuit.

Technical Specifications

Power Field Effect Transistors (FET) STFI13N65M2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

350 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.43 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-281

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

40 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STFI13N65M2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19