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STFI10NK60Z

STMicroelectronics

STFI10NK60Z by STMicroelectronics

STFI10NK60Z by STMicroelectronics is a N-CHANNEL FET with 600V DS breakdown voltage and 36A IDM. Ideal for switching applications, it features a single configuration with built-in diode and operates in enhancement mode. With a max power dissipation of 35W, this MOSFET has a 0.75 ohm RDS(on) and can handle up to 10A drain current.

Median Price

$3.260

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,426 parts In-Stock

1+ parts

$3.260

100+ parts

$1.472

1k+ parts

$1.106

10k+ parts

-

1,426

$3.260

$1.472

$1.106

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,818 parts In-Stock

1+ parts

$3.097

100+ parts

-

1k+ parts

-

10k+ parts

-

2,818

$3.097

-

-

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Vyrian

USA . 1,159 parts In-Stock

1+ parts

$3.260

100+ parts

-

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-

10k+ parts

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1,159

$3.260

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Anansix

USA . 2,141 parts In-Stock

1+ parts

-

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2,141

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-

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ACDS - Activité Composants Distribution Service

France . 1,295 parts In-Stock

1+ parts

-

100+ parts

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1,295

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Bristol Electronics

USA . 1,295 parts In-Stock

1+ parts

-

100+ parts

$1.012

1k+ parts

$0.891

10k+ parts

-

1,295

-

$1.012

$0.891

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Dan-Mar Components

USA . 1,295 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,295

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,540 parts In-Stock

1+ parts

$0.349

100+ parts

-

1k+ parts

$0.314

10k+ parts

-

1,540

$0.349

-

$0.314

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MKK Technologies

India . 188 parts In-Stock

1+ parts

$0.656

100+ parts

-

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188

$0.656

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DigiPath Technology Company

USA . 188 parts In-Stock

1+ parts

$0.656

100+ parts

-

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188

$0.656

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Corphita

USA . 2,449 parts In-Stock

1+ parts

$2.934

100+ parts

-

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2,449

$2.934

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Microchip USA

USA . 143 parts In-Stock

1+ parts

$15.730

100+ parts

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143

$15.730

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Kepictronics

USA . 13,000 parts In-Stock

1+ parts

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13,000

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A-Z Elektronik GmbH

Germany . 5,031 parts In-Stock

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5,031

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Parana Technologies

USA . 1,754 parts In-Stock

1+ parts

-

100+ parts

$0.417

1k+ parts

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1,754

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$0.417

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Perfect Parts

USA . 1,670 parts In-Stock

1+ parts

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100+ parts

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1,670

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Alle Elektronik GmbH

Germany . 1,426 parts In-Stock

1+ parts

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100+ parts

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1,426

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Overview

Discover the STFI10NK60Z by STMicroelectronics, a high-quality N-CHANNEL Power Field Effect Transistor designed for switching applications. With a robust design and reliable performance, this transistor offers customers the value of enhanced efficiency and durability. Ideal for a wide range of applications, this product provides 600V breakdown voltage and a maximum drain current of 10A. Trust in STMicroelectronics for cutting-edge technology that delivers exceptional results in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs generally offer better performance and efficiency compared to P-Channel FETs, making this product a good choice for various applications.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltage applications effectively and safely.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and efficient operation.

Maximum Pulsed Drain Current (IDM): 36 A

With a high pulsed drain current rating, this FET can handle sudden surges of current without damage, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 35 W

This FET can dissipate a high amount of power without overheating, ensuring reliable performance under heavy loads.

Technical Specifications

Power Field Effect Transistors (FET) STFI10NK60Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

300 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.75 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

36 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STFI10NK60Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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